公开(公告)号：US11075492B2

公开(公告)日：2021-07-27

申请号：US16675627

申请日：2019-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Jun You ,  Sung Yong Joo ,  Seong Ho Park ,  Sang Goo Lee

IPC: H01R31/00 ,  H01R31/06 ,  H01R24/20 ,  H01R13/66 ,  G06F1/26

Abstract: Disclosed herein is an adapter and an electronic system. The adapter includes a power cable, a converter arranged on one end of the power cable, and a connector arranged on another end of the power cable and configured to be connected to an electronic device, and the connector includes a connector body formed in a cylindrical shape and an inside of which includes a hollow portion, a first adapter terminal arranged on a circumferential surface of the hollow portion of the connector body, and a second adapter terminal arranged on a circumferential surface of the connector body, and configured to have a power capacity different from a power capacity of the first adapter terminal.

公开(公告)号：US20200013715A1

公开(公告)日：2020-01-09

申请号：US16385188

申请日：2019-04-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doo-Hwan Park ,  Seong Ho Park ,  Kyoung Pil Park ,  Tae Yong Bae ,  Eun-Chul Seo

IPC: H01L23/522 ,  H01L23/528 ,  H01L21/768

Abstract: A semiconductor device is provided. The semiconductor device includes a first wiring and a second wiring disposed at a first metal level, a third wiring and a fourth wiring disposed at a second metal level different from the first metal level, a first via which directly connects the first wiring and the third wiring, a fifth wiring disposed at a third metal level between the first metal level and the second metal level and connected to the second wiring, and a second via which directly connects the fourth wiring and the fifth wiring.

公开(公告)号：US11075160B2

公开(公告)日：2021-07-27

申请号：US16385188

申请日：2019-04-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Doo-Hwan Park ,  Seong Ho Park ,  Kyoung Pil Park ,  Tae Yong Bae ,  Eun-Chul Seo

IPC: H01L23/522 ,  H01L23/528 ,  H01L21/768

Abstract: A semiconductor device is provided. The semiconductor device includes a first wiring and a second wiring disposed at a first metal level, a third wiring and a fourth wiring disposed at a second metal level different from the first metal level, a first via which directly connects the first wiring and the third wiring, a fifth wiring disposed at a third metal level between the first metal level and the second metal level and connected to the second wiring, and a second via which directly connects the fourth wiring and the fifth wiring.

公开(公告)号：US20200059052A1

公开(公告)日：2020-02-20

申请号：US16532865

申请日：2019-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Yong Joo ,  Tae Jun You ,  Seong Ho Park

IPC: H01R31/06 ,  H01R13/631

Abstract: Disclosed herein is an adapter having a plug removably coupled to an adapter body. The adapter includes an adapter body including an adapter pin, a mounting portion provided in the adapter body and including a first mounting portion provided on one side of the adapter body on which the adapter pin is disposed, and a second mounting portion provided on another side of the adapter body, and a plug configured to be removably coupled to the first mounting portion and the second mounting portion wherein a plug terminal provided on one side surface of the plug is electrically connected to the adapter pin provided on the one side of the first mounting portion regardless of an orientation of the plug with respect to the mounting portion.