公开(公告)号：US20190080955A1

公开(公告)日：2019-03-14

申请号：US15944909

申请日：2018-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Seung-Won Shin ,  Su-Ho Lee

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67

Abstract: A lift pin assembly includes a lift pin having a first longitudinal axis substantially parallel with a first direction, a pin connection block combined with a lower end portion of the lift pin and including a first guide recess in a lower end portion of the pin connection block, the first guide recess extending in a second direction substantially perpendicular to the first direction, and a lift pin holder having a second longitudinal axis substantially parallel with the first direction and including a first sliding portion to be received movably in the second direction within the first guide recess by an eccentricity distance of the second longitudinal axis from the first longitudinal axis when the lift pin holder is connected to the lower end portion of the pin connection block.

公开(公告)号：US10770337B2

公开(公告)日：2020-09-08

申请号：US15944909

申请日：2018-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ja-Woo Lee ,  Seung-Won Shin ,  Su-Ho Lee

IPC: B23P19/04 ,  H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  G03F7/20 ,  H01J37/32

Abstract: A lift pin assembly includes a lift pin having a first longitudinal axis substantially parallel with a first direction, a pin connection block combined with a lower end portion of the lift pin and including a first guide recess in a lower end portion of the pin connection block, the first guide recess extending in a second direction substantially perpendicular to the first direction, and a lift pin holder having a second longitudinal axis substantially parallel with the first direction and including a first sliding portion to be received movably in the second direction within the first guide recess by an eccentricity distance of the second longitudinal axis from the first longitudinal axis when the lift pin holder is connected to the lower end portion of the pin connection block.

公开(公告)号：US20150034010A1

公开(公告)日：2015-02-05

申请号：US14202605

申请日：2014-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Su-Ho Lee ,  Su-Hong Kim ,  Jung-Wook Kim ,  Dae-Woo Shin

IPC: H01L21/683 ,  H01L21/02

CPC classification number: H01L21/6875 ,  C23C16/4583 ,  C23C16/46

Abstract: A film deposition apparatus includes a chamber, at least one susceptor disposed inside the chamber and including a seating part, and at least three protrusion parts disposed on the seating part. The seating part is configured to have a wafer seated thereon. The film deposition apparatus further includes a heat source configured to supply heat to the at least one susceptor. The at least three protrusion parts are spaced a distance apart from a center of the at least one susceptor, and the distance is greater than or equal to one third (⅓) of a radius of the wafer seated on the at least one susceptor or greater than or equal to one third (⅓) of a radius of the at least one susceptor.

Abstract translation: 一种成膜装置包括：室，设置在室内的至少一个基座，并且包括座部，以及设置在就座部上的至少三个突出部。 座部件被配置成具有安置在其上的晶片。 成膜装置还包括被配置为向至少一个基座提供热量的热源。 所述至少三个突起部分与所述至少一个基座的中心隔开一段距离，并且所述距离大于或等于位于所述至少一个基座上的所述晶片的半径的三分之一（1/3）或更大 大于或等于所述至少一个基座的半径的三分之一（1/3）。