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公开(公告)号：US20250022842A1
公开(公告)日：2025-01-16
申请号：US18748254
申请日：2024-06-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ilbok Lee , Sungeun Kim , Younglyong Kim
IPC: H01L23/00 , H01L23/498 , H01L23/538 , H01L25/16 , H10B80/00
Abstract: A semiconductor package includes a package substrate, a sub-package arranged on the package substrate, an underfill material layer arranged between the package substrate and the sub-package, a dam structure spaced apart from the sub-package, on the package substrate, and extending to surround the underfill material layer, and an ejection prevention barrier arranged on one side of the sub-package, on the package substrate, and spaced apart from the sub-package in a first horizontal direction with the dam structure therebetween, wherein a top surface of the dam structure has a first vertical level, and a top surface of the ejection prevention barrier has a second vertical level higher than the first vertical level.
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公开(公告)号：US10009534B2
公开(公告)日：2018-06-26
申请号：US15041478
申请日：2016-02-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungeun Kim
CPC classification number: H04N5/23212 , G06K9/00228 , H04N5/23219 , H04N5/23293
Abstract: An electronic device comprising: a memory; a display; a camera; and at least one processor operatively coupled to the memory, configured to: acquire a preview image by using the camera; display the preview image on the display; identify a plurality of areas in the preview image that satisfy a predetermined condition; and modify a focus detection area associated with the camera to include the plurality of areas.
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公开(公告)号：US20240284664A1
公开(公告)日：2024-08-22
申请号：US18462677
申请日：2023-09-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungeun Kim , Jinyeong Kim , Sungyeon Ryu , Hyeonok Jung , Sei-Ryung Choi
IPC: H10B12/00
CPC classification number: H10B12/50 , H10B12/315 , H10B12/482 , H10B12/488
Abstract: A semiconductor device includes peripheral active patterns on a substrate, first and second peripheral trench regions adjacent the peripheral active patterns, a first isolation liner on inner surfaces of the first and second peripheral trench regions, a second isolation liner on the first isolation liner in the first and second peripheral trench regions, and a device isolation layer on the second isolation liner in the first and second peripheral trench regions. The device isolation layer includes a seam therein in the second peripheral trench region. A width of the first peripheral trench region is greater than a width of the second peripheral trench region at a first height corresponding to top surfaces of the peripheral active patterns with respect to the substrate.
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公开(公告)号：US12010423B2
公开(公告)日：2024-06-11
申请号：US18126522
申请日：2023-03-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wooyong Lee , Kyungyul Seo , Jonghun Won , Changhoon Kang , Donghyun Kim , Sungeun Kim , Daehyun Sung
CPC classification number: H04N23/67 , H04N7/0127 , G06T2207/10148
Abstract: An electronic device is provided. The electronic device includes at least one processor configured to obtain a plurality of first images as per a first frame rate using the camera based on a signal related to image recording and control the camera to perform focusing of a lens included in the camera on at least one of one or more objects in the plurality of first images while obtaining the plurality of first images, provide a first portion of the plurality of first images as a preview through the display, control the camera to lock the focusing on the at least one object, identify a designated event for slow motion recording while obtaining the plurality of first images, based at least in part on the designated event, obtain a plurality of second images as per a second frame rate higher than the first frame rate using the camera focusing-locked on the at least one object, and provide a video related to the at least one object using a second portion of the plurality of first images and at least one of the plurality of second images.
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公开(公告)号：US11616900B2
公开(公告)日：2023-03-28
申请号：US17705897
申请日：2022-03-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wooyong Lee , Kyungyul Seo , Jonghun Won , Changhoon Kang , Donghyun Kim , Sungeun Kim , Daehyun Sung
Abstract: An electronic device is provided. The electronic device includes at least one processor configured to obtain a plurality of first images as per a first frame rate using the camera based on a signal related to image recording and control the camera to perform focusing of a lens included in the camera on at least one of one or more objects in the plurality of first images while obtaining the plurality of first images, provide a first portion of the plurality of first images as a preview through the display, control the camera to lock the focusing on the at least one object, identify a designated event for slow motion recording while obtaining the plurality of first images, based at least in part on the designated event, obtain a plurality of second images as per a second frame rate higher than the first frame rate using the camera focusing-locked on the at least one object, and provide a video related to the at least one object using a second portion of the plurality of first images and at least one of the plurality of second images.
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Patent Agency Ranking
公开(公告)号：US11290633B2
公开(公告)日：2022-03-29
申请号：US16896651
申请日：2020-06-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wooyong Lee , Kyungyul Seo , Jonghun Won , Changhoon Kang , Donghyun Kim , Sungeun Kim , Daehyun Sung
Abstract: An electronic device is provided. The electronic device includes at least one processor configured to obtain a plurality of first images as per a first frame rate using the camera based on a signal related to image recording and control the camera to perform focusing of a lens included in the camera on at least one of one or more objects in the plurality of first images while obtaining the plurality of first images, provide a first portion of the plurality of first images as a preview through the display, control the camera to lock the focusing on the at least one object, identify a designated event for slow motion recoding while obtaining the plurality of first images, based at least in part on the designated event, obtain a plurality of second images as per a second frame rate higher than the first frame rate using the camera focusing-locked on the at least one object, and provide a video related to the at least one object using a second portion of the plurality of first images and at least one of the plurality of second images.
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7.发明授权公开(公告)号：US12021032B2
公开(公告)日：2024-06-25
申请号：US18326325
申请日：2023-05-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yanggyoo Jung , Jinhyun Kang , Sungeun Kim , Sangmin Yong , Seungkwan Ryu
IPC: H01L23/538 , H01L23/00 , H01L23/498 , H01L25/065
CPC classification number: H01L23/5383 , H01L23/49816 , H01L24/16 , H01L24/73 , H01L25/0655 , H01L24/32 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/1517
Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer includes a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.
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8.发明授权公开(公告)号：US11694961B2
公开(公告)日：2023-07-04
申请号：US17208512
申请日：2021-03-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yanggyoo Jung , Jinhyun Kang , Sungeun Kim , Sangmin Yong , Seungkwan Ryu
IPC: H01L23/538 , H01L23/498 , H01L25/065 , H01L23/00
CPC classification number: H01L23/5383 , H01L23/49816 , H01L24/16 , H01L24/73 , H01L25/0655 , H01L24/32 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/1517
Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer in a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.
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9.发明申请公开(公告)号：US20210391265A1
公开(公告)日：2021-12-16
申请号：US17208512
申请日：2021-03-22
Applicant: SAMSUNG ELECTRONICS CO., LTD
Inventor： Yanggyoo Jung , Jinhyun Kang , Sungeun Kim , Sangmin Yong , Seungkwan Ryu
IPC: H01L23/538 , H01L23/498 , H01L25/065 , H01L23/00
Abstract: A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer in a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.
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公开(公告)号：US10715716B2
公开(公告)日：2020-07-14
申请号：US16284348
申请日：2019-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wooyong Lee , Kyungyul Seo , Jonghun Won , Changhoon Kang , Donghyun Kim , Sungeun Kim , Daehyun Sung
Abstract: An electronic device is provided. The electronic device includes at least one processor configured to obtain a plurality of first images for one or more objects as per a first frame rate using the camera based on a signal related to image recording and control the camera to perform focusing of a lens included in the camera on at least one of the one or more objects while obtaining the plurality of first images, provide a first portion of the plurality of first images as a preview through the display, control the camera to lock the focusing to prevent a change of the focusing on the at least one object, and identify a designated event related to obtaining the plurality of first images.
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