公开(公告)号：US20140374883A1

公开(公告)日：2014-12-25

申请号：US14197203

申请日：2014-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： CHOONGBIN YIM ,  HYEONGMUN KANG ,  TAESUNG PARK ,  EUNCHUL AHN

IPC: H01L23/544 ,  H01L21/3105

CPC classification number: H01L23/544 ,  H01L21/3105 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package, comprising: a semiconductor substrate; a mold layer on the semiconductor substrate; and a marking formed on a surface of the mold layer, the marking comprising dot markings substantially discontinuously arranged in vertical and horizontal directions of a display region. An effective area of the dot markings within a unit display region of the marking is smaller than about half a total area of the unit display region.

Abstract translation: 一种半导体封装，包括：半导体衬底; 半导体衬底上的模具层; 以及形成在所述模具层的表面上的标记，所述标记包括基本上不连续地布置在显示区域的垂直和水平方向上的点标记。 标记的单位显示区域内的点标记的有效面积小于单位显示区域的总面积的约一半。