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    MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES
    3.
    发明申请
    MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES 审中-公开
    多芯电路板与光纤套件

    公开(公告)号：US20130126219A1

    公开(公告)日：2013-05-23

    申请号：US13657253

    申请日：2012-10-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Pyoungwan Kim ,  Taeeun Kim

    IPC: H05K1/02 ,  B32B3/10 ,  H05K1/11

    CPC classification number: B32B3/10 ,  H01L23/14 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/029 ,  Y10T428/24124 ,  Y10T428/2481 ,  H01L2924/00

    Abstract: Provided is a circuit board that includes a first layer on which circuit patterns are disposed, a second layer opposite to the first layer and on which external terminals are disposed, and a core portion disposed between the first and second layers and including a first ply and a second ply which are stacked. The first ply includes a first fiber bundle extending in a first direction, a second fiber bundle extending in a second direction, and a non-fiber area defined by the first and second fiber bundles. The second ply includes a first fiber bundle extending in a third direction and a second fiber bundle extending in a fourth direction. The first and second fiber bundles of the second ply overlap at least part of the non-fiber area of the first ply.

    Abstract translation: 本发明提供一种电路板，其具有设置有电路图案的第一层，与第一层相对的第二层，配置有外部端子的第一层和设置在第一层和第二层之间的芯部，并且包括第一层和 堆叠的第二层。 第一层包括沿第一方向延伸的第一纤维束，在第二方向上延伸的第二纤维束和由第一和第二纤维束限定的非纤维区域。 第二层包括沿第三方向延伸的第一纤维束和沿第四方向延伸的第二纤维束。 第二层的第一和第二纤维束与第一层的非纤维区域的至少一部分重叠。

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