公开(公告)号：US20240183657A1

公开(公告)日：2024-06-06

申请号：US18527700

申请日：2023-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke NAGATOMO ,  Shinji UEYAMA ,  Takamasa SUGIURA ,  Euisun CHOI ,  Fumitaka MOROISHI ,  Masanori IZUMITA ,  Takahiro TOKUMIYA ,  Tatsuya ISHIMOTO ,  Masato KAJINAMI

IPC: G01B11/30

CPC classification number: G01B11/303 ,  G01B11/306

Abstract: An optical device includes a monochromatic light source, a light distribution switching portion configured to transmit monochromatic light emitted from the monochromatic light source in one fan-shaped region among a plurality of fan-shaped regions centered on a central optical axis and block the monochromatic light in other fan-shaped regions, an objective lens, an aperture stop configured to collect reflected light from the object, an imaging lens, which has passed through the aperture stop, a light receiver on an imaging plane formed by the imaging lens and configured to receive the reflected light from the object and photoelectrically convert the received reflected light, and a controller configured to instruct the light distribution switching portion to change a region transmitting light over time, and calculate a normal direction of the object based on an electrical signal photoelectrically converted by the light receiver.

公开(公告)号：US20200217805A1

公开(公告)日：2020-07-09

申请号：US16583434

申请日：2019-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takamasa SUGIURA ,  Fumitaka MOROISHI ,  Masato KAJINAMI

IPC: G01N21/95 ,  H01L21/687 ,  H01L21/67 ,  G01N21/64 ,  G01N21/88 ,  H04N5/235 ,  H04N5/225 ,  G06T7/00

Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

公开(公告)号：US20220157633A1

公开(公告)日：2022-05-19

申请号：US17385095

申请日：2021-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masato KAJINAMI ,  Takamasa SUGIURA ,  Fumitaka MOROISHI

IPC: H01L21/68 ,  H01L21/683

Abstract: A wafer bonding apparatus may include a first chuck, a second chuck, and a pressure device. The first chuck may include a hole formed through a central portion of the first chuck. The second chuck may have a hole formed through a central portion of the second chuck. The pressure device may be configured to pressurize a wafer toward the second chuck through the holes. An air bearing may be interposed between the pressure device and the first chuck to suppress a dislocation of the pressure device.