FLUID PRESSURE ACTUATOR
    1.
    发明申请
    FLUID PRESSURE ACTUATOR 有权
    流体压力执行器

    公开(公告)号:US20150159681A1

    公开(公告)日:2015-06-11

    申请号:US14562179

    申请日:2014-12-05

    Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

    Abstract translation: 一种流体压力致动器,包括具有第一位置检测器和第二位置检测器的流体压力缸,具有活塞头和杆的活塞体,所述活塞头安装在所述杆上并可滑动地容纳在所述流体压力缸中,所述杆包括 第一刻度和第二刻度,所述第一刻度面向所述第一位置检测器和所述第一位置检测器,所述第一位置检测器被配置为检测所述活塞体的滑动方向上的位置,所述第二刻度尺面向所述第二位置检测器,所述第二位置检测器被配置为 检测杆在活塞体的旋转方向上的位置,并且可以设置用于执行杆在滑动方向上的位置的第一定位控制和杆沿旋转方向的第二定位控制的控制器 。

    SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICONDUCTOR DEVICE USING THE SAME
    2.
    发明申请
    SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICONDUCTOR DEVICE USING THE SAME 有权
    半导体芯片接合装置及其形成使用其的半导体器件的方法

    公开(公告)号:US20150024551A1

    公开(公告)日:2015-01-22

    申请号:US14283238

    申请日:2014-05-21

    Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

    Abstract translation: 一种制造半导体器件的方法包括:提供包括内部布线的第一基板,所述第一基板包括具有第一芯片安装区域的芯片安装区域阵列; 将第一衬底放置在第一载体线上; 提供第一半导体芯片; 将第一半导体芯片放置在第一可移动托盘上; 将第一基板的第一芯片安装区域与第一半导体芯片垂直对准,并且将第一半导体芯片初始接合到第一基板的第一芯片安装区域; 以及在所述第一基板的初始接合的第一半导体芯片和第一安装区域上进行后续的接合,从而在所述第一安装区域将所述第一半导体芯片与所述第一基板更牢固地接合。 在执行第一衬底上的至少一个其它半导体芯片的后续接合之后发生初始接合。

    OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD

    公开(公告)号:US20240183657A1

    公开(公告)日:2024-06-06

    申请号:US18527700

    申请日:2023-12-04

    CPC classification number: G01B11/303 G01B11/306

    Abstract: An optical device includes a monochromatic light source, a light distribution switching portion configured to transmit monochromatic light emitted from the monochromatic light source in one fan-shaped region among a plurality of fan-shaped regions centered on a central optical axis and block the monochromatic light in other fan-shaped regions, an objective lens, an aperture stop configured to collect reflected light from the object, an imaging lens, which has passed through the aperture stop, a light receiver on an imaging plane formed by the imaging lens and configured to receive the reflected light from the object and photoelectrically convert the received reflected light, and a controller configured to instruct the light distribution switching portion to change a region transmitting light over time, and calculate a normal direction of the object based on an electrical signal photoelectrically converted by the light receiver.

    POLARIZED MICROSCOPE AND INTRA IMAGE FIELD CORRECTION ANALYSIS METHOD

    公开(公告)号:US20230305282A1

    公开(公告)日:2023-09-28

    申请号:US18175452

    申请日:2023-02-27

    CPC classification number: G02B21/0092 G02B21/06 G02B21/361

    Abstract: The polarized microscope includes a light source configured to generate illumination light, a polarizer configured to interact with the generated illumination light to transmit rectilinear polarized light having a first orientation, an analyzer configured to transmit a component of rectilinear polarized light reflected by a sample, the reflected rectilinear polarized light having a second orientation, an image obtainer configured to obtain an image of the reflected rectilinear polarized light, and an image processor configured to process the obtained image, wherein the image processor is configured to calculate a device integer, obtain a plurality of hysteresis loops for each of regions of interest (ROIs), and calculate a rotation angle of a Kerr rotation of each ROI by using the device integer and the plurality of hysteresis loops.

    INSPECTION DEVICE
    6.
    发明申请

    公开(公告)号:US20230125628A1

    公开(公告)日:2023-04-27

    申请号:US18047820

    申请日:2022-10-19

    Abstract: To reduce a measurement time, an inspection device includes a stage configured to fix a magnetoresistive random access memory (MRAM) to a stage surface and moving the MRAM, a plurality of magnets configured to generate a gradient magnetic, a plurality of line sensors comprising a first line sensor for detecting a magneto-optical effect at a first location of the MRAM and a second line sensor for detecting the magneto-optical effect at a second location that is different from the first location by moving a location of the MRAM within the gradient magnetic field, and an information processor configured to process the magneto-optical effect detected by the plurality of line sensors. Thus, throughput may be improved.

    MAGNETIC PROPERTY MEASUREMENT APPARATUS

    公开(公告)号:US20220137160A1

    公开(公告)日:2022-05-05

    申请号:US17467967

    申请日:2021-09-07

    Abstract: The inventive concepts provide a magnetic property measurement apparatus capable of quickly measuring a magnetic property of a subject without a decrease in a measurement speed that might occur due to an electromagnet. In addition, the inventive concepts provide a magnetic property measurement apparatus capable of monitoring a magnetization distribution of a memory device as an image and integrating images by using a TDI camera, thereby being capable of performing highly sensitive measurement and not having to capture images for a long time. The magnetic property measurement apparatus includes: a magnetic field generation unit configured to generate a magnetic field which is constant with time and varies with relative position; a mobile unit configured to move a subject to be measured in the magnetic field; and a measurement unit configured to measure a magnetic property of the subject moving in the magnetic field.

    WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND APPARATUS THEREFOR

    公开(公告)号:US20200209164A1

    公开(公告)日:2020-07-02

    申请号:US16678226

    申请日:2019-11-08

    Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.

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