公开(公告)号：US20190186960A1

公开(公告)日：2019-06-20

申请号：US16131467

申请日：2018-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun JO ,  YOUNGSHIN KWON ,  Minjin KIM ,  WOONBAE KIM ,  YOUNGDOO JUNG ,  Eunhee JUNG ,  INHO CHOI

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US20240014092A1

公开(公告)日：2024-01-11

申请号：US18175947

申请日：2023-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YECHUNG CHUNG ,  WOONBAE KIM

IPC: H01L23/367 ,  H01L23/498

CPC classification number: H01L23/367 ,  H01L23/4985 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L24/16

Abstract: A semiconductor package includes a flexible base film, a semiconductor chip on a first surface of the base film, and a heat radiating member on a second surface of the base film. The base film has a recess pattern in the second surface. The recess pattern is adjacent the semiconductor chip. The heat radiating member may be in the recess pattern.

公开(公告)号：US20230197747A1

公开(公告)日：2023-06-22

申请号：US18167972

申请日：2023-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： WOONBAE KIM

IPC: H01L27/146 ,  H01L23/58 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14603 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14634 ,  H01L27/14625 ,  H01L23/58 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/06 ,  H01L27/1462 ,  H01L23/02

Abstract: A semiconductor package may include an image sensor chip, a transparent substrate spaced apart from the image sensor chip, a joining structure in contact with a top surface of the image sensor chip and a bottom surface of the transparent substrate, on an edge region of the top surface of the image sensor chip, and a circuit substrate electrically connected to the image sensor chip. The image sensor chip may include a penetration electrode which penetrates at least a portion of an internal portion of the image sensor chip, and a terminal pad, which is on the edge region of the top surface of the image sensor chip and is electrically connected to the penetration electrode. The joining structure may include a spacer and an adhesive layer. The joining structure may overlap the terminal pad. The spacer is between the transparent substrate and the terminal pad.

公开(公告)号：US20210050377A1

公开(公告)日：2021-02-18

申请号：US16830710

申请日：2020-03-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： WOONBAE KIM

IPC: H01L27/146

Abstract: A semiconductor package may include an image sensor chip, a transparent substrate spaced apart from the image sensor chip, a joining structure in contact with a top surface of the image sensor chip and a bottom surface of the transparent substrate, on an edge region of the top surface of the image sensor chip, and a circuit substrate electrically connected to the image sensor chip. The image sensor chip may include a penetration electrode which penetrates at least a portion of an internal portion of the image sensor chip, and a terminal pad, which is on the edge region of the top surface of the image sensor chip and is connected to the penetration electrode. The joining structure may include a spacer and an adhesive layer which is between and attached to the spacer and the image sensor chip. The joining structure may the terminal pad.

公开(公告)号：US20200372232A1

公开(公告)日：2020-11-26

申请号：US16989974

申请日：2020-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： WOONBAE KIM ,  Jikho SONG ,  Sungeun JO ,  Ji-Yong PARK ,  Jeong-Kyu HA

IPC: G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.