SEMICONDUCTOR MEMORY DEVICE
    2.
    发明公开

    公开(公告)号:US20230320080A1

    公开(公告)日:2023-10-05

    申请号:US18093561

    申请日:2023-01-05

    CPC classification number: H10B12/485 H10B12/482 H10B12/488

    Abstract: A semiconductor memory device includes an active portion defined by a device isolation pattern, the active portion including a first impurity region located at a center portion of the active portion and a second impurity region located at an end portion of the active portion, a word line provided on the active portion and extending in a first direction, a bit line provided on the word line and extending in a second direction crossing the first direction, a bit line contact provided between the bit line and the first impurity region of the active portion, a storage node pad provided on the second impurity region of the active portion, and a storage node contact provided on the storage node pad and at a side of the bit line.

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