公开(公告)号：US20150324064A1

公开(公告)日：2015-11-12

申请号：US14801117

申请日：2015-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwon Ju YI ,  Chang Kyu CHOI ,  Jae Joon HAN ,  Du-Sik PARK ,  Woon Bae KIM ,  Jong Oh KWON

IPC: G06F3/042 ,  G06F3/041

CPC classification number: G06F3/0425 ,  G06F3/0416 ,  G06F2203/04106

Abstract: A multi-touch sensing apparatus using a rear view camera of an array type is provided. The multi-touch sensing apparatus may include a display panel to display an image, a sensing light source to emit light to sense a touch image which is generated by an object and displayed on a back side of the display panel, and a camera to divide and sense the touch image. The camera may be arranged in an edge of a lower side of the multi-touch sensing apparatus, or a mirror to reflect the touch image may be included in the multi-touch sensing apparatus.

Abstract translation: 提供了使用阵列型后视摄像机的多点触摸感测装置。 多点触摸感测装置可以包括用于显示图像的显示面板，用于发光以感测由对象产生并显示在显示面板的背面上的触摸图像的感测光源以及显示在显示面板的背面的相机 并感觉触摸图像。 照相机可以布置在多点触摸感测装置的下侧的边缘中，或者可以将反映触摸图像的反射镜包括在多点触摸感测装置中。

公开(公告)号：US20240258489A1

公开(公告)日：2024-08-01

申请号：US18491145

申请日：2023-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woon Bae KIM ,  Ye Chung CHUNG

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/64

Abstract: A display device is provided. The display device includes a substrate including a display region and a non-display region adjacent to the display region in a first horizontal direction, a light-emitting element layer on an upper surface of the substrate in the display region, a thin-film substrate connected to the upper surface of the substrate in the non-display region, a first semiconductor chip on a lower surface of the substrate, at least a portion of the first semiconductor chip overlapping with the thin-film substrate in a vertical direction, and a first through-via in the non-display region, the first through-via extending through the substrate in the vertical direction, the first through-via electrically connecting the thin-film substrate and the first semiconductor chip to each other.