公开(公告)号：US11923264B2

公开(公告)日：2024-03-05

申请号：US17002096

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongha Kim

IPC: H01L23/34 ,  C09J9/02 ,  H01L23/373 ,  H01L23/482 ,  H01L23/538

CPC classification number: H01L23/34 ,  C09J9/02 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/4828 ,  C09J2203/326 ,  C09J2301/124 ,  C09J2301/314 ,  H01L23/5387

Abstract: A semiconductor apparatus includes: a system substrate; a semiconductor package mounted on the system substrate and having a first length in a first horizontal direction; a conductive label flexible and arranged on the semiconductor package, the conductive label including: a first adhesive layer contacting the semiconductor package; a thermally-conductive layer attached to the semiconductor package by the first adhesive layer and having a second length in the first horizontal direction greater than the first length; and a second adhesive layer contacting a portion of a surface of the conductive layer, the portion not vertically overlapping the semiconductor package; a thermal interface material (TIM) arranged on the conductive layer to vertically overlap the semiconductor package; and a cover including: a first cover portion vertically overlapping the semiconductor package and contacting the TIM; and a second cover portion to which the thermally-conductive layer is attached by the second adhesive layer.

公开(公告)号：US12283576B2

公开(公告)日：2025-04-22

申请号：US17713309

申请日：2022-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongha Kim ,  Bonggyu Kang ,  Youngsoo Jang

IPC: H01L25/10

Abstract: An electronic device includes a substrate, a first plate having a first internal surface facing a first surface of the substrate, and at least one first through-hole and at least one second through-hole, first and second semiconductor packages spaced apart from each other between the first surface and the first internal surface, a first thermal interface material layer contacting an upper surface of the first semiconductor package and the first internal surface, and filling at least a portion of the at least one first through-hole, and a second thermal interface material layer contacting an upper surface of the second semiconductor package and the first internal surface, and filling at least a portion of the at least one second through-hole. At least one of side surfaces of the first and second thermal interface material layers is exposed to an empty space between the first internal surface and the first surface.

公开(公告)号：US12038558B2

公开(公告)日：2024-07-16

申请号：US17261898

申请日：2019-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongyi Kim ,  Min Kim ,  Yongha Kim ,  Yongjoon Choi

IPC: G02B1/115 ,  G02B1/14

CPC classification number: G02B1/115 ,  G02B1/14

Abstract: Disclosed is an electronic device. An electronic device according to various embodiments includes: a housing; a first glass plate attached to the housing and forming a portion of an external surface of the electronic device, wherein the first glass plate includes a flat portion, a curved portion extending from an edge of the flat portion, a first surface facing outwardly from the electronic device, and a second surface facing inwardly towards the electronic device; and a coating layer formed on the first surface of the first glass plate, wherein the coating layer includes a first layer having a first refractive index and containing at least one first material, and includes a second layer disposed further from the first surface than the first layer, containing at least one second material, and having a second refractive index different from the first refractive index.

公开(公告)号：US20210090968A1

公开(公告)日：2021-03-25

申请号：US17002096

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongha Kim

IPC: H01L23/34 ,  H01L23/482 ,  C09J9/02

Abstract: A semiconductor apparatus includes: a system substrate; a semiconductor package mounted on the system substrate and having a first length in a first horizontal direction; a conductive label flexible and arranged on the semiconductor package, the conductive label including: a first adhesive layer contacting the semiconductor package; a thermally-conductive layer attached to the semiconductor package by the first adhesive layer and having a second length in the first horizontal direction greater than the first length; and a second adhesive layer contacting a portion of a surface of the conductive layer, the portion not vertically overlapping the semiconductor package; a thermal interface material (TIM) arranged on the conductive layer to vertically overlap the semiconductor package; and a cover including: a first cover portion vertically overlapping the semiconductor package and contacting the TIM; and a second cover portion to which the thermally-conductive layer is attached by the second adhesive layer.