公开(公告)号：US20150060032A1

公开(公告)日：2015-03-05

申请号：US14540435

申请日：2014-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Chul KWON ,  Sung Woo Kim ,  Euy Sung Chu ,  Jee Yong Kim

IPC: F24F12/00 ,  F28D9/00

CPC classification number: F24F12/006 ,  F28D9/00 ,  F28D9/0062 ,  F28F9/001 ,  Y02B30/16 ,  Y02B30/563

Abstract: A heat exchanger usable with a ventilator, the heat exchanger having an improved structure so that air passing through the heat exchanger may be prevented from leaking. The heat exchanger of the general inventive concept includes a heat-exchanging element having a plurality of liners stacked in a uniformly spaced state and a plurality of spacers disposed between the liners to define air passages, and corner guides respectively coupled to corners of the heat-exchanging element. Each of the corner guides includes a guide channel forming a space to receive the corner of the heat-exchanging element so that the corner guides securely come into close contact with the heat-exchanging element, and to minimize a loosening of the corner guide due to an adhesive applied between the heat-exchanging element and the corner guide.

Abstract translation: 一种与呼吸机一起使用的热交换器，该热交换器具有改进的结构，使得可以防止通过热交换器的空气泄漏。 总体发明构思的热交换器包括具有以均匀间隔的状态堆叠的多个衬垫的热交换元件和设置在衬套之间的多个间隔件以限定空气通道，以及分别连接到热交换器的角部的拐角导向器， 交换元素 每个拐角引导件包括形成用于接收热交换元件的角部的空间的引导通道，使得角部引导件牢固地与热交换元件紧密接触，并且最小化角引导件的松动，由于 施加在热交换元件和拐角引导件之间的粘合剂。

公开(公告)号：US20200298346A1

公开(公告)日：2020-09-24

申请号：US16517789

申请日：2019-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Chul KWON ,  Man-Hee HAN

IPC: B23K26/53 ,  H01L21/268 ,  H01L21/78 ,  B23K26/06 ,  B23K26/073 ,  B23K26/08 ,  B23K26/402

Abstract: A laser apparatus may include a spectrum controller and a spectrum modulator. The spectrum controller may control a center wavelength and/or a bandwidth of a spectrum of a laser beam. The spectrum modulator may modulate the spectrum of the laser beam having the center wavelength and/or the bandwidth controlled by the spectrum controller. Thus, the laser beam may have the spectrum optimal for a semiconductor fabrication process. Particularly, the substrate may be accurately diced using the laser beam having the optimal spectrum.