公开(公告)号：US10475972B2

公开(公告)日：2019-11-12

申请号：US16192864

申请日：2018-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-sub Lee ,  Yong-il Kim ,  Han-kyu Seong ,  Young-jin Choi

IPC: H01L33/58 ,  H01L33/60 ,  F21K9/237 ,  H01L33/50 ,  H01L33/62 ,  H01L33/48 ,  F21K9/233 ,  F21K9/27 ,  G09F13/00 ,  H01L33/30 ,  H01L33/32 ,  H01L33/06 ,  F21V8/00 ,  G02F1/1335 ,  F21K9/232 ,  F21K9/275 ,  F21Y115/10 ,  F21S8/02 ,  F21V23/04 ,  F21Y103/10

Abstract: A light-emitting diode (LED) package includes: a reflective structure including a cavity, a bottom portion having a through hole, and a sidewall portion surrounding the cavity and the bottom portion and having an inclined inner side surface; an electrode pad inserted into the through hole; an LED on the bottom portion in the cavity, the LED including a light-emitting structure electrically connected to the electrode pad and a phosphor formed on the light-emitting structure; and a lens structure filling the cavity and formed on the reflective structure.

公开(公告)号：US10164159B2

公开(公告)日：2018-12-25

申请号：US15703098

申请日：2017-09-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-sub Lee ,  Yong-il Kim ,  Han-kyu Seong ,  Young-jin Choi

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L33/58 ,  H01L33/50 ,  F21K9/275 ,  H01L33/32 ,  H01L33/30 ,  F21K9/232 ,  F21V8/00 ,  F21K9/237 ,  H01L33/06 ,  G02F1/1335

Abstract: A light-emitting diode (LED) package includes: a reflective structure including a cavity, a bottom portion having a through hole, and a sidewall portion surrounding the cavity and the bottom portion and having an inclined inner side surface; an electrode pad inserted into the through hole; an LED on the bottom portion in the cavity, the LED including a light-emitting structure electrically connected to the electrode pad and a phosphor formed on the light-emitting structure; and a lens structure filling the cavity and formed on the reflective structure.