公开(公告)号：US11417386B2

公开(公告)日：2022-08-16

申请号：US17205832

申请日：2021-03-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  H01L23/498 ,  G11C5/04 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  G11C29/02 ,  G11C29/50 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US11328760B2

公开(公告)日：2022-05-10

申请号：US16527415

申请日：2019-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  G11C5/04 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C29/02 ,  G11C29/50 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US10418087B2

公开(公告)日：2019-09-17

申请号：US15640854

申请日：2017-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C29/02 ,  G11C29/50 ,  G11C5/04 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US12079092B2

公开(公告)日：2024-09-03

申请号：US18151591

申请日：2023-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changmin Choi ,  Younggyun Lee ,  Youngdae Lee ,  Hyeonkyoon Lim ,  Yeunwook Lim

IPC: G06F11/00 ,  G06F11/14 ,  G06F21/60

CPC classification number: G06F11/1469 ,  G06F11/1464 ,  G06F21/602

Abstract: An electronic device is provided. The electronic device includes a communication circuit, a processor, and a memory. The memory may store instructions that, when executed, allow the processor to connect to an external electronic device by using the communication circuit, receive, from the external electronic device, backup data including application information and application-related data, install a plurality of applications by using the application information, and on the basis of priority orders, sequentially restore configurations of the plurality of applications by using the application-related data.

公开(公告)号：US11837273B2

公开(公告)日：2023-12-05

申请号：US17872720

申请日：2022-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C29/02 ,  G11C29/50 ,  G11C5/04 ,  G11C7/10

CPC classification number: G11C11/4072 ,  G11C5/04 ,  G11C11/408 ,  G11C11/409 ,  G11C29/022 ,  G11C29/028 ,  G11C29/50008 ,  H01L23/49838 ,  H01L25/0655 ,  G11C7/109 ,  G11C7/1063 ,  G11C7/1075 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US11189067B2

公开(公告)日：2021-11-30

申请号：US16678337

申请日：2019-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younggyun Lee ,  Youngdae Lee ,  Yeunwook Lim

IPC: G06T11/60 ,  G06T7/593 ,  G06T11/00

Abstract: An electronic device is provided. The electronic device includes a display, a processor operatively connected to the display, and a memory operatively connected to the processor. The memory may store instructions that, when executed, cause the processor to obtain a first image including at least one object, detect a designated region in the first image by using the at least one object, display a guide indicating the designated region and a content generation tool on the display, receive a first user input through the display for generating or editing at least one content using the content generation tool, determine attribute information about the at least one content at least partially based on the designated region or the first user input, and store the determined attribute information and the at least one content in the memory. Various other embodiments can be provided.

公开(公告)号：US10359878B2

公开(公告)日：2019-07-23

申请号：US15245688

申请日：2016-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongwook Seo ,  Doo-Yong Park ,  Young-Gyun Lee ,  Youngdae Lee ,  Jaehak Lee ,  Eun-Yeung Lee ,  Cheongjae Lee

IPC: G06F3/044 ,  G06F3/041 ,  G06F3/0488

Abstract: An apparatus and a method for generating events corresponding to the touch attributes in the electronic device are provided. The apparatus, including an electronic device, may include a touch sensor and a processor. The processor is configured to control for determining at least one touch attribute including at least one of an intensity, an area, and a direction of a touch input based on a change in the capacitance in the touch sensor due to the touch input on the touch sensor, and executing a function corresponding to a predetermined criterion if the at least one touch attribute satisfies the predetermined criterion.

公开(公告)号：US09805769B2

公开(公告)日：2017-10-31

申请号：US14697634

申请日：2015-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C5/04 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C11/4072 ,  G11C29/02 ,  G11C29/50 ,  G11C7/10

CPC classification number: G11C11/4072 ,  G11C5/04 ,  G11C7/1063 ,  G11C7/1075 ,  G11C7/109 ,  G11C11/408 ,  G11C11/409 ,  G11C29/022 ,  G11C29/028 ,  G11C29/50008 ,  H01L23/49838 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US10521031B2

公开(公告)日：2019-12-31

申请号：US15996186

申请日：2018-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungjun Kim ,  Jongwu Baek ,  Eunyeung Lee ,  Sangheon Kim ,  Youngdae Lee ,  Inhyung Jung ,  Hochang Chae

IPC: G06F3/038 ,  G06F3/0354 ,  G06F3/041 ,  G06F3/147 ,  G06F3/0488

Abstract: An electronic device and a method are disclosed. The electronic device includes a housing, a display, a first communication circuit, a detection circuit, a memory, and a processor. The detection circuit is configured to detect a stylus pen when the stylus pen including a second communication circuit is located within a predetermined distance range from the display. The processor is operably connected to the display, the first communication circuit, the detection circuit, and the memory. The processor is configured to receive a signal containing unique identification information from the stylus pen. The processor is also configured to execute a first application program while receiving an input generated based on a touch by the stylus pen on the display or generated based on a movement of the stylus pen detected within the predetermined distance range. The processor is further configured to associate the unique identification information with the first application program.

公开(公告)号：US10971208B2

公开(公告)日：2021-04-06

申请号：US16734821

申请日：2020-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C29/02 ,  G11C29/50 ,  G11C5/04 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.