公开(公告)号：US10249544B2

公开(公告)日：2019-04-02

申请号：US15654899

申请日：2017-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-yoon Ryu ,  Chung-sam Jun ,  Yu-sin Yang ,  Yun-jung Jee ,  Gil-woo Song

IPC: H01L21/00 ,  H01L21/66 ,  G06K9/00 ,  G06K9/46 ,  H01L21/77 ,  G06K9/20

Abstract: Provided are a method of inspecting a surface and a method of manufacturing a semiconductor device. The methods include preparing a substrate, selecting a spatial resolution of a first optical device by setting a magnification of an imaging optical system, emitting multi-wavelength light toward a first measurement area of the substrate and obtaining first wavelength-specific images, generating first spectrum data based on the first wavelength-specific images, generating first spectrum data of respective pixels based on the first wavelength-specific images, and extracting a spectrum of at least one first inspection area having a range of the first measurement area or less from the first spectrum data, and analyzing the spectrum. The first optical device includes a light source, an objective lens, a detector, and an imaging optical system. The obtaining first wavelength-specific images includes using the imaging optical system and the detector.

公开(公告)号：US11043433B2

公开(公告)日：2021-06-22

申请号：US16803459

申请日：2020-02-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-yoon Ryu ,  Chung-sam Jun ,  Yu-sin Yang ,  Yun-jung Jee ,  Gil-woo Song

IPC: G06K9/00 ,  H01L21/66 ,  G06K9/20 ,  G06K9/46 ,  H01L21/77

Abstract: Provided are a method of inspecting a surface and a method of manufacturing a semiconductor device. The methods include preparing a substrate, selecting a spatial resolution of a first optical device by setting a magnification of an imaging optical system, emitting multi-wavelength light toward a first measurement area of the substrate and obtaining first wavelength-specific images, generating first spectrum data based on the first wavelength-specific images, generating first spectrum data of respective pixels based on the first wavelength-specific images, and extracting a spectrum of at least one first inspection area having a range of the first measurement area or less from the first spectrum data, and analyzing the spectrum. The first optical device includes a light source, an objective lens, a detector, and an imaging optical system. The obtaining first wavelength-specific images includes using the imaging optical system and the detector.

公开(公告)号：US20160261786A1

公开(公告)日：2016-09-08

申请号：US14959443

申请日：2015-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-ho Ahn ,  Yu-sin Yang ,  Yun-jung Jee ,  Woo-seok Ko

IPC: H04N5/232 ,  G06T7/00 ,  H04N5/225 ,  H04N13/02

CPC classification number: H04N5/23212 ,  G06T7/0004 ,  G06T2207/30148 ,  H04N5/2256 ,  H04N13/20

Abstract: Provided is a wafer inspection apparatus using three-dimensional (3D) images, which apparatus may acquire a 3D image by adjusting a focal position at a high speed, and inspect a wafer by using the 3D image so that a 3D inspection operation may be precisely performed on patterns formed on the wafer at a high speed. The wafer inspection apparatus may include a stage on which a wafer is disposed, an optical apparatus configured to acquire an image of a pattern formed on the wafer by using a scan method, a focus adjusting unit configured to change a focal position of light irradiated to the wafer according to a scan speed of the optical apparatus, and an image processor configured to integrate images corresponding to focal positions and generate and analyze 3D images.

Abstract translation: 提供了使用三维（3D）图像的晶片检查装置，该装置可以通过高速调节焦点位置来获取3D图像，并且通过使用3D图像来检查晶片，使得3D检查操作可以精确地 以高速度在晶片上形成的图案上进行。 晶片检查装置可以包括设置晶片的台，配置为通过使用扫描方法获取形成在晶片上的图案的图像的光学装置，配置为改变照射到的光的焦点位置的聚焦调整单元 根据所述光学装置的扫描速度的所述晶片，以及被配置为对与焦点位置相对应的图像进行积分并生成和分析3D图像的图像处理器。