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公开(公告)号:US20160153915A1
公开(公告)日:2016-06-02
申请号:US14955635
申请日:2015-12-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kang-woong Ko , Sung-yoon Ryu , Young-hoon Sohn , Gil-woo Song , Tae-heung Ahn , Hyoung-jo Jeon , Sang-kyeong Han , Masahiro Horie , Woo-seok Ko , Yu-sin Yang , Sang-kil Lee , Byeong-hwan Jeon
CPC classification number: G01N21/8806 , G01J4/00 , G01J2004/001 , G01N21/21 , G01N21/211 , G01N21/9501 , G01N21/956 , G01N2021/213 , G01N2021/8848
Abstract: A surface inspecting method includes: irradiating an incident light beam of a first polarized state on a target object, the incident light beam comprising parallel light and having a cross-sectional area: measuring a second polarized state of a reflected light beam reflected from the target object; and performing inspection on an entire area of the target object on which the incident light beam is irradiated, based on a variation between the first polarized state and the second polarized state.
Abstract translation: 表面检查方法包括:在目标物体上照射第一偏振态的入射光束,入射光束包括平行光并具有横截面积:测量从目标反射的反射光束的第二偏振状态 目的; 并且基于第一极化状态和第二极化状态之间的变化,对照射入射光的目标物体的整个区域进行检查。
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公开(公告)号:US10249544B2
公开(公告)日:2019-04-02
申请号:US15654899
申请日:2017-07-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sung-yoon Ryu , Chung-sam Jun , Yu-sin Yang , Yun-jung Jee , Gil-woo Song
Abstract: Provided are a method of inspecting a surface and a method of manufacturing a semiconductor device. The methods include preparing a substrate, selecting a spatial resolution of a first optical device by setting a magnification of an imaging optical system, emitting multi-wavelength light toward a first measurement area of the substrate and obtaining first wavelength-specific images, generating first spectrum data based on the first wavelength-specific images, generating first spectrum data of respective pixels based on the first wavelength-specific images, and extracting a spectrum of at least one first inspection area having a range of the first measurement area or less from the first spectrum data, and analyzing the spectrum. The first optical device includes a light source, an objective lens, a detector, and an imaging optical system. The obtaining first wavelength-specific images includes using the imaging optical system and the detector.
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公开(公告)号:US11043433B2
公开(公告)日:2021-06-22
申请号:US16803459
申请日:2020-02-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sung-yoon Ryu , Chung-sam Jun , Yu-sin Yang , Yun-jung Jee , Gil-woo Song
Abstract: Provided are a method of inspecting a surface and a method of manufacturing a semiconductor device. The methods include preparing a substrate, selecting a spatial resolution of a first optical device by setting a magnification of an imaging optical system, emitting multi-wavelength light toward a first measurement area of the substrate and obtaining first wavelength-specific images, generating first spectrum data based on the first wavelength-specific images, generating first spectrum data of respective pixels based on the first wavelength-specific images, and extracting a spectrum of at least one first inspection area having a range of the first measurement area or less from the first spectrum data, and analyzing the spectrum. The first optical device includes a light source, an objective lens, a detector, and an imaging optical system. The obtaining first wavelength-specific images includes using the imaging optical system and the detector.
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公开(公告)号:US10001444B2
公开(公告)日:2018-06-19
申请号:US14955635
申请日:2015-12-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kang-woong Ko , Sung-yoon Ryu , Young-hoon Sohn , Gil-woo Song , Tae-heung Ahn , Hyoung-jo Jeon , Sang-kyeong Han , Masahiro Horie , Woo-seok Ko , Yu-sin Yang , Sang-kil Lee , Byeong-hwan Jeon
IPC: G01N21/88 , G01J4/00 , G01N21/21 , G01N21/956 , G01N21/95
CPC classification number: G01N21/8806 , G01J4/00 , G01J2004/001 , G01N21/21 , G01N21/211 , G01N21/9501 , G01N21/956 , G01N2021/213 , G01N2021/8848
Abstract: A surface inspecting method includes: irradiating an incident light beam of a first polarized state on a target object, the incident light beam comprising parallel light and having a cross-sectional area: measuring a second polarized state of a reflected light beam reflected from the target object; and performing inspection on an entire area of the target object on which the incident light beam is irradiated, based on a variation between the first polarized state and the second polarized state.
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