公开(公告)号：US10778178B2

公开(公告)日：2020-09-15

申请号：US15899121

申请日：2018-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon Ghim ,  Jeongho Kang ,  Namwoo Kim ,  Yunbum Lee ,  Haimin Lee

IPC: H03H7/46 ,  H04B1/00 ,  H04B1/28 ,  H04W88/02 ,  H04W72/04 ,  H04W8/00 ,  H04B1/403

Abstract: A front end module supporting a plurality of frequency bands and an electronic device includes a plurality of duplexers, a first switch configured to connect any one of the plurality of duplexers to an antenna, a second switch configured to connect a first port, to which a Tx signal of a first communication or a Tx signal of a second communication is input, to any one of Tx ports of the plurality of duplexers, and to connect a second port, from which a Rx signal of the second communication is output, to one of the Tx ports of the plurality of duplexers. According to certain embodiments, the number of switches occupying a large space can be minimized, and thus a space occupied by the front end module supporting device to device (D2D) communication can be reduced.

公开(公告)号：US11283156B2

公开(公告)日：2022-03-22

申请号：US16788925

申请日：2020-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggil Jeon ,  Namwoo Kim ,  Seongbeom Hong ,  Kyunghoon Moon ,  Yunbum Lee

IPC: H01Q1/24

Abstract: Disclosed is an electronic device including a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the first plate and the second plate, a first antenna structure disposed to be substantially parallel with the second plate in the space, and including a substrate disposed in the space, and at least one antenna element disposed on the substrate to face at least the second plate, a conductive member disposed in the space and spaced apart from the at least one antenna element by a predetermined interval when the second plate is viewed from above.

公开(公告)号：US11881647B2

公开(公告)日：2024-01-23

申请号：US17250491

申请日：2019-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon Ghim ,  Jeongho Kang ,  Youngmin Lee ,  Yunbum Lee ,  Seongbeom Hong

IPC: H01R12/79 ,  H01P3/08 ,  H04B1/00 ,  H04M1/02

CPC classification number: H01R12/79 ,  H01P3/08 ,  H04B1/0071 ,  H04M1/0274

Abstract: The disclosure relates to an apparatus for connecting modules included in an electronic device, and the apparatus may comprise: a power source between a first module of an electronic device and a second module of the electronic device; at least one line unit including lines for transferring a control signal, an intermediate (IF) signal, or a radio frequency (RF) signal; a first connector unit for connecting at least one of the lines to the first module; a second connector unit for connecting at least one of the lines to the second module; and a connection unit for connecting at least one external apparatus and at least one line for transferring the IF signal or the RF signal from among the lines.

公开(公告)号：US11588220B2

公开(公告)日：2023-02-21

申请号：US17162110

申请日：2021-01-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunbum Lee ,  Seongbeom Hong ,  Kyunghoon Moon ,  Seunggil Jeon ,  Jaeyoung Huh ,  Jinsang Kim ,  Sungchul Park

IPC: H01Q1/02 ,  H01Q9/04 ,  H01Q21/08 ,  H01Q19/09 ,  H01Q21/28 ,  H01Q23/00 ,  H01Q1/24 ,  H01Q1/22 ,  H01Q1/40

Abstract: An electronic device is provided. The electronic device includes a display having a first surface, a metal frame structure configured to form a side surface of the electronic device, a rear plate having a second surface facing a third direction, at least one antenna module disposed inside the side surface and having a radiation surface, at least one dielectric layer having at least a partial region attached to the radiation surface, and a wireless communication circuit configured to transmit or receive an radio frequency (RF) signal to or from the at least one antenna module, in which the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, in which the first dielectric sheet is made of a thermal conductive material having a first permittivity and the second dielectric sheet is made of a material having a second permittivity larger than the first permittivity.

公开(公告)号：US11777193B2

公开(公告)日：2023-10-03

申请号：US16866011

申请日：2020-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggil Jeon ,  Namwoo Kim ,  Seongbeom Hong ,  Kyunghoon Moon ,  Yunbum Lee

IPC: H01Q1/00 ,  H01Q1/24 ,  H04M1/02 ,  H01Q21/06

CPC classification number: H01Q1/243 ,  H01Q21/065 ,  H04M1/0266 ,  H04M1/0277

Abstract: An electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The support member includes a conductive first portion forming a lateral appearance of the electronic device, a second portion adjacent to the array antenna, the front cover, and the conductive first portion, and having at least one opening filled with a non-conductive material, and a third portion including a non-conductive material and disposed adjacent to the array antenna, the rear cover, and the conductive first portion. The conductive first portion is exposed to an outside of the electronic device, and the second and third portions are hidden by the front and rear covers. A beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.

公开(公告)号：US10826162B1

公开(公告)日：2020-11-03

申请号：US16884713

申请日：2020-05-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggil Jeon ,  Namwoo Kim ,  Seongbeom Hong ,  Kyunghoon Moon ,  Yunbum Lee

IPC: H01Q1/24 ,  H04M1/02 ,  H01Q21/06

Abstract: An electronic device is provided. The electronic device includes a front cover, a rear cover, an array antenna, and a support member. The support member includes a conductive first portion forming a lateral appearance of the electronic device, a second portion adjacent to the array antenna, the front cover, and the conductive first portion, and having at least one opening filled with a non-conductive material, and a third portion including a non-conductive material and disposed adjacent to the array antenna, the rear cover, and the conductive first portion. The conductive first portion is exposed to an outside of the electronic device, and the second and third portions are hidden by the front and rear covers. A beam formed by the array antenna is radiated to the outside through the at least one opening and the third portion.