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公开(公告)号:US20250107029A1
公开(公告)日:2025-03-27
申请号:US18973393
申请日:2024-12-09
Applicant: Samtec, Inc.
Inventor: Burrell G. BEST , Brian R. VICICH , Kevin R. MEREDITH , Chadrick P. FAITH , Istvan NOVAK , Jonathan E. BUCK
Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.
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2.
公开(公告)号:US20230156953A1
公开(公告)日:2023-05-18
申请号:US17917659
申请日:2021-04-07
Applicant: Samtec, Inc.
Inventor: Burrell G. BEST , Brian R. VICICH , Kevin R. MEREDITH , Chadrick P. FAITH , Istvan NOVAK , Jonathan E. BUCK
CPC classification number: H05K7/1461 , H05K9/0018 , H01F27/36 , H05K1/0209 , H01R12/737 , H01R12/721
Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.
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