公开(公告)号：US20250107029A1

公开(公告)日：2025-03-27

申请号：US18973393

申请日：2024-12-09

Applicant: Samtec, Inc.

Inventor： Burrell G. BEST ,  Brian R. VICICH ,  Kevin R. MEREDITH ,  Chadrick P. FAITH ,  Istvan NOVAK ,  Jonathan E. BUCK

IPC: H05K7/14 ,  H01F27/36 ,  H01R12/72 ,  H01R12/73 ,  H05K1/02 ,  H05K9/00

Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

公开(公告)号：US20170003465A1

公开(公告)日：2017-01-05

申请号：US15265885

申请日：2016-09-15

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Randall E. MUSSER ,  Jean-Marc A. VERDIELL ,  John A. MONGOLD ,  Brian R. VICICH ,  Keith R. GUETIG

IPC: G02B6/42 ,  H01R13/639

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

Abstract translation: 互连系统包括第一电路板，连接到第一电路板的第一和第二连接器，以及收发器，包括光引擎，并被布置成通过电缆接收和发送电信号和光信号，以将从电缆接收的光信号转换为 电信号，以及将从第一连接器接收的电信号转换为通过电缆传输的光信号。 收发器布置成与第一和第二连接器配合，使得至少一些转换的电信号被传输到第一连接器，使得从电缆接收的至少一些电信号被传送到第二连接器。

公开(公告)号：US20160056562A1

公开(公告)日：2016-02-25

申请号：US14463721

申请日：2014-08-20

Applicant: Samtec, Inc.

Inventor： John Allen MONGOLD ,  Brian R. VICICH ,  Donald Christopher KNOWLDEN

IPC: H01R12/91 ,  H01R12/72

CPC classification number: H01R12/91

Abstract: A connector includes a body, a slot within the body configured to receive a substrate and including a first end and a second end, contacts arranged along the slot between the first end and the second end, and a biasing mechanism arranged at the first end to align the substrate as the substrate is inserted into the slot so that substrate is in contact with the second end when the substrate is fully inserted into the slot.

Abstract translation: 连接器包括主体，主体内的狭槽，构造成接收基板并且包括第一端和第二端，沿着第一端和第二端之间的槽布置的接触件，以及偏置机构，其布置在第一端 当衬底被插入槽中时，对准衬底，使得当衬底完全插入槽中时，衬底与第二端接触。

公开(公告)号：US20170271834A1

公开(公告)日：2017-09-21

申请号：US15610881

申请日：2017-06-01

Applicant: Samtec, Inc.

Inventor： Keith R. GUETIG ,  Brian R. VICICH ,  Andrew R. COLLINGWOOD ,  Travis S. ELLIS

IPC: H01R43/16

CPC classification number: H01R43/16 ,  H01R9/032 ,  H01R12/592 ,  H01R12/594 ,  Y10T29/49174

Abstract: A contact ribbon configured to connect a cable to a substrate includes a plurality of signal contacts, a ground plane, and at least one ground contact extending from the ground plane. The plurality of signal contacts are connected by a support member, and the support member is removable after the plurality of signal contacts are connected to the cable.

公开(公告)号：US20170219788A1

公开(公告)日：2017-08-03

申请号：US15485557

申请日：2017-04-12

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Randall E. MUSSER ,  Jean-Marc A. VERDIELL ,  John A. MONGOLD ,  Brian R. VICICH ,  Keith R. GUETIG

IPC: G02B6/42 ,  H04B10/25 ,  H04B10/40 ,  H04B10/80 ,  H01R12/71 ,  H04B10/27

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US20230251441A1

公开(公告)日：2023-08-10

申请号：US18134647

申请日：2023-04-14

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Randall E. MUSSER ,  Jean-Marc A. VERDIELL ,  John A. MONGOLD ,  Brian R. VICICH ,  Keith R. GUETIG

IPC: G02B6/42 ,  H04B10/25 ,  H04B1/3827 ,  H04B10/40 ,  H04B10/27 ,  H04B10/80 ,  H05K7/20 ,  H01R13/639 ,  H01R12/71

CPC classification number: G02B6/4284 ,  G02B6/428 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/4292 ,  G02B6/4293 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H04B10/25891 ,  H05K7/20418 ,  H01L2224/48091 ,  H01L2224/49175

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US20200003976A1

公开(公告)日：2020-01-02

申请号：US16564092

申请日：2019-09-09

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Randall E. MUSSER ,  Jean-Marc A. VERDIELL ,  John A. MONGOLD ,  Brian R. VICICH ,  Keith R. GUETIG

IPC: G02B6/42 ,  H04B1/3827 ,  H04B10/40 ,  H04B10/27 ,  H04B10/25 ,  H04B10/80 ,  H05K7/20 ,  H01R13/639 ,  H01R12/71

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US20160327761A1

公开(公告)日：2016-11-10

申请号：US15211138

申请日：2016-07-15

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Randall E. MUSSER ,  Jean-Marc A. VERDIELL ,  John A. MONGOLD ,  Brian R. VICICH ,  Keith R. GUETIG

IPC: G02B6/42 ,  H05K7/20

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US20240402446A1

公开(公告)日：2024-12-05

申请号：US18804721

申请日：2024-08-14

Applicant: Samtec, Inc.

Inventor： Eric J. ZBINDEN ,  Randall E. MUSSER ,  Jean-Marc A. VERDIELL ,  John A. MONGOLD ,  Brian R. VICICH ,  Keith R. GUETIG

IPC: G02B6/42 ,  H01R12/71 ,  H01R13/639 ,  H04B1/3827 ,  H04B10/25 ,  H04B10/27 ,  H04B10/40 ,  H04B10/80 ,  H05K7/20

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US20230156953A1

公开(公告)日：2023-05-18

申请号：US17917659

申请日：2021-04-07

Applicant: Samtec, Inc.

Inventor： Burrell G. BEST ,  Brian R. VICICH ,  Kevin R. MEREDITH ,  Chadrick P. FAITH ,  Istvan NOVAK ,  Jonathan E. BUCK

IPC: H05K7/14 ,  H05K9/00 ,  H01F27/36 ,  H05K1/02 ,  H01R12/73 ,  H01R12/72

CPC classification number: H05K7/1461 ,  H05K9/0018 ,  H01F27/36 ,  H05K1/0209 ,  H01R12/737 ,  H01R12/721

Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.