OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP
    3.
    发明申请
    OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP 审中-公开
    光学模块,包括硅胶片和耦合芯片

    公开(公告)号:US20160266322A1

    公开(公告)日:2016-09-15

    申请号:US15067542

    申请日:2016-03-11

    Applicant: Samtec, Inc.

    Abstract: An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

    Abstract translation: 光学模块包括传输光信号的波导互连; 调制光信号的硅光子芯片,检测光信号,或调制并检测光信号; 连接到硅光子芯片和波导互连的耦合器芯片,使得光信号沿着硅光子芯片和波导互连之间的光路传输; 并且其中一个硅光子芯片和耦合器芯片包括第一,第二和第三对准突起。 耦合器芯片和硅光子芯片中的另一个包括点接触,线性接触和平面接触。 点接触不提供第一对准突起的移动。 线性接触为第二对准突起提供线性运动。 平面接触为第三对准突起提供平面运动。

    CONTROLLED ATTENUATION OF A REFLECTION FROM A COATED SURFACE

    公开(公告)号:US20240302608A1

    公开(公告)日:2024-09-12

    申请号:US18283555

    申请日:2022-04-05

    Applicant: Samtec, Inc.

    CPC classification number: G02B6/4214

    Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a reflective surface formed by a coating which is textured to attenuate the light transmitted through the optical block. The reflective surface is encapsulated so that its reflective properties are not affected by liquids or contaminants on an outer surface of the coating.

    OPTICAL TRANSCEIVER
    5.
    发明申请
    OPTICAL TRANSCEIVER 审中-公开

    公开(公告)号:US20190033542A1

    公开(公告)日:2019-01-31

    申请号:US16073111

    申请日:2017-01-27

    Applicant: SAMTEC INC.

    Abstract: An optical transceiver can include a transmitter having a photonic integrated circuit, and a receiver having a current-to-voltage converter and a photodetector in electrical communication with the current-to-voltage converter and separate from the photonic integrated circuit. Each of the transmitter and the receiver can include an interconnect member that includes first and second optical paths for the propagation of optical transmit signals and optical receive signals, respectively. The interconnect members of the transmitter and receiver can further define electrical paths that are configured to connect to an underlying substrate at one end, and the transmitter and receiver, respectively. The interconnect members can be separate from each other or can define a single monolithic interconnect member.

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