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    DATA COMMUNICATION LINE AND CONNECTOR
    1.
    发明公开
    DATA COMMUNICATION LINE AND CONNECTOR 审中-公开

    公开(公告)号：US20240266706A1

    公开(公告)日：2024-08-08

    申请号：US18566363

    申请日：2022-06-03

    Applicant: SAMTEC, INC.

    Inventor： Marc EPITAUX ,  Thomas Albert HALL, III

    IPC: H01P3/16

    CPC classification number: H01P3/16

    Abstract: A data communication connector can include a dielectric waveguide that extends along a central axis, and a recess that is configured to receive an antenna. The data communication connector can include an electrically conductive body that receives the dielectric waveguide. The electrically conductive body can define the recess. The dielectric waveguide can include a dielectric core, a ground shield, and a jacket.

    OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP
    3.
    发明申请
    OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP 审中-公开
    光学模块，包括硅胶片和耦合芯片

    公开(公告)号：US20160266322A1

    公开(公告)日：2016-09-15

    申请号：US15067542

    申请日：2016-03-11

    Applicant: Samtec, Inc.

    Inventor： Marc EPITAUX ,  Joshua Rajiv CORNELIUS ,  John L. NIGHTINGALE

    IPC: G02B6/30 ,  G02B6/42 ,  G02B6/12

    CPC classification number: G02B6/4292 ,  G02B6/12007 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/138 ,  G02B6/2938 ,  G02B6/3652 ,  G02B6/4214 ,  G02B6/428

    Abstract: An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

    Abstract translation: 光学模块包括传输光信号的波导互连; 调制光信号的硅光子芯片，检测光信号，或调制并检测光信号; 连接到硅光子芯片和波导互连的耦合器芯片，使得光信号沿着硅光子芯片和波导互连之间的光路传输; 并且其中一个硅光子芯片和耦合器芯片包括第一，第二和第三对准突起。 耦合器芯片和硅光子芯片中的另一个包括点接触，线性接触和平面接触。 点接触不提供第一对准突起的移动。 线性接触为第二对准突起提供线性运动。 平面接触为第三对准突起提供平面运动。

    OPTICAL INTERPOSER
    6.
    发明申请
    OPTICAL INTERPOSER 有权

    公开(公告)号：US20210215897A1

    公开(公告)日：2021-07-15

    申请号：US16967493

    申请日：2019-02-05

    Applicant: SAMTEC, INC.

    Inventor： Marc EPITAUX ,  John CORONATI

    IPC: G02B6/43 ,  G02B6/42

    Abstract: Waveguides of optically transparent interposers are adiabatically coupled to respective waveguides of photonic integrated circuits that are mounted to the optically transparent interposers. In particular, photonic integrated circuits can be mounted to an interposer that has both optical connections and electrical connections. The optical connections of the interposer can be adiabatically coupled to the photonic integrated circuit. The electrical connections can be connected to the photonic integrated circuit and to a host board that also supports an ASIC.

    OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION
    7.
    发明申请
    OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION 有权

    公开(公告)号：US20250054929A1

    公开(公告)日：2025-02-13

    申请号：US18722873

    申请日：2022-12-22

    Applicant: SAMTEC, INC.

    Inventor： Marc EPITAUX ,  John CORONATI

    IPC: H01L25/16 ,  G02B6/42 ,  H01L23/00 ,  H01L23/44 ,  H01L23/498

    Abstract: An optical engine having an optically transparent substrate with a lens on a first major surface and an optoelectronic element on an opposed second major surface is described. The optical engine has a sealed optical path and is capable of operating submerged in a cooling liquid. The optical engine may be attached to a mounting substrate to form an optoelectronic subassembly that may be incorporated in many different types of optical interconnects.

    OPTICAL TRANSCEIVER
    8.
    发明申请
    OPTICAL TRANSCEIVER 审中-公开

    公开(公告)号：US20190033542A1

    公开(公告)日：2019-01-31

    申请号：US16073111

    申请日：2017-01-27

    Applicant: SAMTEC INC.

    Inventor： Marc EPITAUX ,  John L. NIGHTINGALE

    IPC: G02B6/42 ,  G02B6/35

    Abstract: An optical transceiver can include a transmitter having a photonic integrated circuit, and a receiver having a current-to-voltage converter and a photodetector in electrical communication with the current-to-voltage converter and separate from the photonic integrated circuit. Each of the transmitter and the receiver can include an interconnect member that includes first and second optical paths for the propagation of optical transmit signals and optical receive signals, respectively. The interconnect members of the transmitter and receiver can further define electrical paths that are configured to connect to an underlying substrate at one end, and the transmitter and receiver, respectively. The interconnect members can be separate from each other or can define a single monolithic interconnect member.

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