公开(公告)号：US20160266322A1

公开(公告)日：2016-09-15

申请号：US15067542

申请日：2016-03-11

Applicant: Samtec, Inc.

Inventor： Marc EPITAUX ,  Joshua Rajiv CORNELIUS ,  John L. NIGHTINGALE

IPC: G02B6/30 ,  G02B6/42 ,  G02B6/12

CPC classification number: G02B6/4292 ,  G02B6/12007 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/138 ,  G02B6/2938 ,  G02B6/3652 ,  G02B6/4214 ,  G02B6/428

Abstract: An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

Abstract translation: 光学模块包括传输光信号的波导互连; 调制光信号的硅光子芯片，检测光信号，或调制并检测光信号; 连接到硅光子芯片和波导互连的耦合器芯片，使得光信号沿着硅光子芯片和波导互连之间的光路传输; 并且其中一个硅光子芯片和耦合器芯片包括第一，第二和第三对准突起。 耦合器芯片和硅光子芯片中的另一个包括点接触，线性接触和平面接触。 点接触不提供第一对准突起的移动。 线性接触为第二对准突起提供线性运动。 平面接触为第三对准突起提供平面运动。