公开(公告)号：US20110165823A1

公开(公告)日：2011-07-07

申请号：US12748109

申请日：2010-03-26

申请人： Satoru IDE ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

发明人： Satoru IDE ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

IPC分类号： B24B1/00 ,  B24B41/00 ,  B24B7/10

CPC分类号： B24B37/00

摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

摘要翻译： 一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。 一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。 同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

公开(公告)号：US08366514B2

公开(公告)日：2013-02-05

申请号：US12748109

申请日：2010-03-26

申请人： Satoru Ide ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

发明人： Satoru Ide ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

IPC分类号： B24B1/00 ,  B24B5/02

CPC分类号： B24B37/00

摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

摘要翻译： 一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。 一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。 同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

公开(公告)号：US08047897B2

公开(公告)日：2011-11-01

申请号：US12356793

申请日：2009-01-21

申请人： Moriyuki Kashiwa ,  Etsuo Fujita ,  Kazuo Kobayashi ,  Tomio Kubo

发明人： Moriyuki Kashiwa ,  Etsuo Fujita ,  Kazuo Kobayashi ,  Tomio Kubo

IPC分类号： B24B49/00

CPC分类号： B24B7/228 ,  B24B41/047

摘要： To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

摘要翻译： 为了提供高刚性的平面研磨装置，基板平面磨削装置具有三个具有运动联接的紧固板提升和降低机构以及将紧固板向上或向下移动的气缸杆。 作为紧固板6的负载也是进行研磨的磨石14的载荷的高刚性研磨装置，即使是半导体基板，也可以获得所获得的基板的厚度分布的偏转小 具有450mm的大的基材直径。

公开(公告)号：US07238087B1

公开(公告)日：2007-07-03

申请号：US11608106

申请日：2006-12-07

申请人： Moriyuki Kashiwa ,  Hirotaka Okonogi ,  Kazuo Kobayashi

发明人： Moriyuki Kashiwa ,  Hirotaka Okonogi ,  Kazuo Kobayashi

IPC分类号： B24B1/00

CPC分类号： B24B37/04 ,  B24B7/228 ,  B24B41/005 ,  B24B51/00

摘要： A substrate-planarizing device and method of using the device comprising a substrate storage stage outside a room, and on a base inside the room, a multi-joint transfer robot, a temporary alignment platform, a movable transfer pad, a grinding process stage in which substrate holders that compose three stages of a substrate loading/unloading stage, a rough grinding stage, a finish grinding stage are arranged in a concentric pattern on the first index rotary table, and a polishing process stage that has a substrate holder table composing a substrate loading/unloading/finish polishing stage as well as a substrate holder table composing a rough polishing stage arranged in a concentric pattern on the second index rotary table.

摘要翻译： 一种基板平面化装置和使用该装置的方法，该装置包括室外的基板储存台，以及室内的基座，多关节转印机器人，临时对准平台，可移动转印垫， 构成基板装载/卸载阶段的三个阶段的基板保持器，粗磨阶段，精磨阶段以同心图案布置在第一分度旋转台上，以及抛光处理阶段，其具有构成 基板装载/卸载/精抛光阶段以及构成在第二分度旋转台上以同心图案布置的粗抛光台的基板保持台。