公开(公告)号：US20090203299A1

公开(公告)日：2009-08-13

申请号：US12356793

申请日：2009-01-21

申请人： Moriyuki KASHIWA ,  Etsuo Fujita ,  Kazuo Kobayashi ,  Tomio Kubo

发明人： Moriyuki KASHIWA ,  Etsuo Fujita ,  Kazuo Kobayashi ,  Tomio Kubo

IPC分类号： B24B41/04 ,  B24B7/20 ,  B24B41/00

CPC分类号： B24B7/228 ,  B24B41/047

摘要： To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

摘要翻译： 为了提供高刚性的平面研磨装置，基板平面磨削装置具有三个具有运动联接的紧固板提升和降低机构以及将紧固板向上或向下移动的气缸杆。 作为紧固板6的负载也是进行研磨的磨石14的载荷的高刚性研磨装置，即使是半导体基板，也可以获得所获得的基板的厚度分布的偏转小 具有450mm的大的基材直径。

公开(公告)号：US08047897B2

公开(公告)日：2011-11-01

申请号：US12356793

申请日：2009-01-21

申请人： Moriyuki Kashiwa ,  Etsuo Fujita ,  Kazuo Kobayashi ,  Tomio Kubo

发明人： Moriyuki Kashiwa ,  Etsuo Fujita ,  Kazuo Kobayashi ,  Tomio Kubo

IPC分类号： B24B49/00

CPC分类号： B24B7/228 ,  B24B41/047

摘要： To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

摘要翻译： 为了提供高刚性的平面研磨装置，基板平面磨削装置具有三个具有运动联接的紧固板提升和降低机构以及将紧固板向上或向下移动的气缸杆。 作为紧固板6的负载也是进行研磨的磨石14的载荷的高刚性研磨装置，即使是半导体基板，也可以获得所获得的基板的厚度分布的偏转小 具有450mm的大的基材直径。

公开(公告)号：US20110165823A1

公开(公告)日：2011-07-07

申请号：US12748109

申请日：2010-03-26

申请人： Satoru IDE ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

发明人： Satoru IDE ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

IPC分类号： B24B1/00 ,  B24B41/00 ,  B24B7/10

CPC分类号： B24B37/00

摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

摘要翻译： 一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。 一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。 同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

公开(公告)号：US08366514B2

公开(公告)日：2013-02-05

申请号：US12748109

申请日：2010-03-26

申请人： Satoru Ide ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

发明人： Satoru Ide ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

IPC分类号： B24B1/00 ,  B24B5/02

CPC分类号： B24B37/00

摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

摘要翻译： 一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。 一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。 同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

公开(公告)号：US07238087B1

公开(公告)日：2007-07-03

申请号：US11608106

申请日：2006-12-07

申请人： Moriyuki Kashiwa ,  Hirotaka Okonogi ,  Kazuo Kobayashi

发明人： Moriyuki Kashiwa ,  Hirotaka Okonogi ,  Kazuo Kobayashi

IPC分类号： B24B1/00

CPC分类号： B24B37/04 ,  B24B7/228 ,  B24B41/005 ,  B24B51/00

摘要： A substrate-planarizing device and method of using the device comprising a substrate storage stage outside a room, and on a base inside the room, a multi-joint transfer robot, a temporary alignment platform, a movable transfer pad, a grinding process stage in which substrate holders that compose three stages of a substrate loading/unloading stage, a rough grinding stage, a finish grinding stage are arranged in a concentric pattern on the first index rotary table, and a polishing process stage that has a substrate holder table composing a substrate loading/unloading/finish polishing stage as well as a substrate holder table composing a rough polishing stage arranged in a concentric pattern on the second index rotary table.

摘要翻译： 一种基板平面化装置和使用该装置的方法，该装置包括室外的基板储存台，以及室内的基座，多关节转印机器人，临时对准平台，可移动转印垫， 构成基板装载/卸载阶段的三个阶段的基板保持器，粗磨阶段，精磨阶段以同心图案布置在第一分度旋转台上，以及抛光处理阶段，其具有构成 基板装载/卸载/精抛光阶段以及构成在第二分度旋转台上以同心图案布置的粗抛光台的基板保持台。

公开(公告)号：US07101080B2

公开(公告)日：2006-09-05

申请号：US10868807

申请日：2004-06-17

申请人： Kazuo Kobayashi ,  Etsuo Fujita

发明人： Kazuo Kobayashi ,  Etsuo Fujita

IPC分类号： F16C32/06

CPC分类号： F16C32/0662 ,  F16C29/025

摘要： A non-contact type hydrostatic linear guide device includes a guide unit having a pair of rail parts on the top surface thereof, and a slide unit having oil pockets in a running surface thereof. A load of the slide unit concentrates on the frame of the guide unit. The slide unit has a stepped leg structure in which projections are disposed in the under surface of a table thereof in bilateral symmetry. The projections contact the top surface of inner projections disposed on the guide unit and the outer side surfaces thereof face the inner surfaces of the wear plates disposed on the guide unit, and wear plates are placed outward in the midway of the under surfaces of the projections as the side surfaces thereof face the both side surfaces of the first recessed part and the third recessed part of the guide unit.

摘要翻译： 非接触型静液压线性引导装置包括：导向单元，其具有在其顶表面上的一对轨道部分，以及在其行进表面中具有油穴的滑动单元。 滑动单元的载荷集中在导向单元的框架上。 滑动单元具有阶梯腿结构，其中突起以双侧对称的方式设置在其桌的下表面中。 凸起接触设置在引导单元上的内部突起的顶面，其外侧表面面对设置在引导单元上的耐磨板的内表面，并且耐磨板向外放置在凸起的下表面的中间 因为其侧表面面对引导单元的第一凹部和第三凹部的两侧面。

公开(公告)号：US20050147332A1

公开(公告)日：2005-07-07

申请号：US10868807

申请日：2004-06-17

申请人： Kazuo Kobayashi ,  Etsuo Fujita

发明人： Kazuo Kobayashi ,  Etsuo Fujita

IPC分类号： B23Q1/26 ,  F16C29/02 ,  F16C32/06

CPC分类号： F16C32/0662 ,  F16C29/025

摘要： A non-contact type hydrostatic linear guide device includes a guide unit having a pair of rail parts on the top surface thereof, and a slide unit having oil pockets in a running surface thereof. A load of the slide unit concentrates on the frame of the guide unit. The slide unit has a stepped leg structure in which projections are disposed in the under surface of a table thereof in bilateral symmetry. The projections contact the top surface of inner projections disposed on the guide unit and the outer side surfaces thereof face the inner surfaces of the wear plates disposed on the guide unit, and wear plates are placed outward in the midway of the under surfaces of the projections as the side surfaces thereof face the both side surfaces of the first recessed part and the third recessed part of the guide unit.

摘要翻译： 非接触型静液压线性引导装置包括：导向单元，其具有在其顶表面上的一对轨道部分，以及在其行进表面中具有油穴的滑动单元。 滑动单元的载荷集中在导向单元的框架上。 滑动单元具有阶梯腿结构，其中突起以双侧对称的方式设置在其桌的下表面中。 凸起接触设置在引导单元上的内部突起的顶面，其外侧表面面对设置在引导单元上的耐磨板的内表面，并且耐磨板向外放置在凸起的下表面的中间 因为其侧表面面对引导单元的第一凹部和第三凹部的两侧面。

公开(公告)号：US08404601B2

公开(公告)日：2013-03-26

申请号：US13494418

申请日：2012-06-12

申请人： Kazuo Kobayashi

发明人： Kazuo Kobayashi

IPC分类号： H01L21/31

摘要： A method of manufacturing a semiconductor device according to the present invention includes the steps of: (a) introducing hydrogen and oxygen on a SiC substrate; and (b) subjecting the hydrogen and the oxygen to a combustion reaction on the SiC substrate to form a gate oxide film being a silicon oxide film on a surface of the SiC substrate by the combustion reaction.

公开(公告)号：US20120081475A1

公开(公告)日：2012-04-05

申请号：US13231216

申请日：2011-09-13

申请人： Koichiro HARA ,  Kazuo Kobayashi

发明人： Koichiro HARA ,  Kazuo Kobayashi

IPC分类号： B41J2/045 ,  B41J2/16

CPC分类号： B41J2/14233

摘要： There is provided a liquid discharging head discharging a liquid, including: a channel unit having a liquid channel including a pressure chamber which has an opening at one surface of the channel unit; a piezoelectric element formed of a piezoelectric material; an intermediate member preventing the liquid in the pressure chamber and the piezoelectric element from making contact with each other; a first adhesive layer composed of a first adhesive and adhering the channel unit and the intermediate member, the first adhesive being a thermo-setting adhesive starting to be cured at a first temperature; and a second adhesive layer composed of a second adhesive and adhering the intermediate member and the piezoelectric element, the second adhesive starting to be cured at a second temperature lower than the first temperature.

摘要翻译： 提供了一种排出液体的液体排放头，包括：通道单元，其具有液体通道，该液体通道包括在通道单元的一个表面上具有开口的压力室; 由压电材料形成的压电元件; 防止压力室中的液体和压电元件彼此接触的中间构件; 第一粘合剂层，由第一粘合剂组成并粘合通道单元和中间构件，第一粘合剂是开始在第一温度下固化的热固性粘合剂; 以及第二粘合剂层，由第二粘合剂组成并粘合所述中间构件和所述压电元件，所述第二粘合剂在比所述第一温度低的第二温度下开始固化。

公开(公告)号：US08071709B2

公开(公告)日：2011-12-06

申请号：US12282664

申请日：2007-03-14

申请人： Mitsuru Kishine ,  Hirofumi Nishibayashi ,  Toshiki Ichisaka ,  Kazuo Kobayashi ,  Ryuji Tachibana ,  Tadashi Okawa ,  Katsumi Kihara

发明人： Mitsuru Kishine ,  Hirofumi Nishibayashi ,  Toshiki Ichisaka ,  Kazuo Kobayashi ,  Ryuji Tachibana ,  Tadashi Okawa ,  Katsumi Kihara

IPC分类号： C08G77/24

CPC分类号： C09K3/1018 ,  C08G77/24 ,  C08L27/16 ,  C08L83/04 ,  C08L2205/22 ,  C08L2666/14 ,  C08L83/00

摘要： The present invention provides a novel fluorine-containing rubber composite material having both of excellent fuel impermeability and excellent cold resistance, a fuel impermeable sealing material comprising the composite material and a process for preparing the composite material. The fluorine-containing rubber composite material comprises crosslinked particles of fluorine-containing silicone rubber dispersed in a fluorine-containing rubber. It is preferable that the fluorine-containing rubber comprises a vinylidene fluoride/tetrafluoroethylene/perfluoro vinyl ether copolymer, and the composite material has cold resistance of not more than −35° C. and fuel permeability of not more than 500 g·mm/m2·day. The fuel impermeable sealing material comprises the composite material. The process for preparing the composite material comprises a step for co-coagulation of a fluorine-containing rubber emulsion and an emulsion of crosslinked fluorine-containing silicone rubber.

摘要翻译： 本发明提供一种具有优异的燃料不渗透性和优异的耐寒性的新型含氟橡胶复合材料，包含该复合材料的燃料不可渗透的密封材料以及该复合材料的制备方法。 含氟橡胶复合材料包含分散在含氟橡胶中的含氟硅橡胶的交联颗粒。 含氟橡胶优选包含偏二氟乙烯/四氟乙烯/全氟乙烯基醚共聚物，复合材料的耐寒性不大于-35℃，燃料渗透率不大于500g·mm / m 2 ·天。 燃料不可渗透的密封材料包括复合材料。 制备复合材料的方法包括使含氟橡胶乳液和交联的含氟硅橡胶的乳液共混的步骤。