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公开(公告)号：US09566684B2
公开(公告)日：2017-02-14
申请号：US14636501
申请日：2015-03-03
发明人： Hans-Dieter Braun
CPC分类号： B24B27/0061 , B23Q1/012 , B23Q3/15706 , B23Q3/15733 , B24B3/34 , B24B5/02 , B24B7/005 , Y10T483/1705 , Y10T483/174 , Y10T483/1795 , Y10T483/1882
摘要： A sanding machine, with a machine bed, two vertical supports arranged laterally at the machine bed, with a bridge displaceable on the vertical supports in a horizontal, linear Y-axis, with an X-sled displaceable at the bridge in a horizontal, linear X-axis, with a Z-sled displaceable at the X-sled in a vertical, linear Z-axis, with an operating spindle supported at the Z-sled, particularly a sanding spindle, with a machine table and a magazine wheel comprising tool holders for sanding disks, and which is rotational about an axis parallel in reference to the Z-axis, with the operating spindle being able to remove a tool from a tool holder and place it there when this tool holder is rotated into an exchange position, with the tool magazine being arranged underneath the machine table and in the area of the exchange position.
摘要翻译： 具有机床的砂光机，在机床侧面布置的两个垂直支撑件，其具有可在水平线性Y轴上在垂直支撑件上移位的桥，X轴可在桥梁处以水平线性 X轴，Z轴在X轴上以垂直线性Z轴移位，工作主轴支撑在Z轴，特别是打磨主轴上，机床和刀库轮包括工具 用于打磨盘的支架，其围绕相对于Z轴平行的轴线旋转，其中操作主轴能够从工具夹具移除工具并将其放置在该工具夹持器旋转到更换位置时， 工具箱布置在机台下方和交换位置的区域。
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公开(公告)号：US09539698B2
公开(公告)日：2017-01-10
申请号：US13836329
申请日：2013-03-15
申请人： Mori Seiki USA
摘要： A method of grind hardening a workpiece is provided. The method may include securing the workpiece in a workpiece retainer and a grind tool in a tool retainer, rotating the grind tool in a first angular direction at a first angular speed, controlling the workpiece and tool retainers such that the grind tool engages the workpiece, and controlling the workpiece and tool retainers such that the grind tool is guided along a grinding track of the workpiece. The grind tool may engage and/or disengage the workpiece at portions of sacrificial material disposed thereon. Coolant and cleaning nozzles may be provided and controlled such that at least a portion of the coolant from the coolant nozzle is diverted to the cleaning nozzle in a manner which reduces heat dissipation, improves thermal efficiency of the grind hardening and reduces loading of the grind tool.
摘要翻译： 提供了一种研磨硬化工件的方法。 该方法可以包括将工件固定在工件保持器中，并将研磨工具固定在工具保持器中，使第一角度方向以第一角速度旋转研磨工具，控制工件和工具保持器，使得研磨工具与工件接合， 并且控制工件和工具保持器，使得研磨工具沿着工件的磨削轨道被引导。 研磨工具可以在设置在其上的牺牲材料的部分处接合和/或分离工件。 可以提供和控制冷却剂和清洁喷嘴，使得来自冷却剂喷嘴的冷却剂的至少一部分以减少散热的方式转移到清洁喷嘴，提高研磨硬化的热效率并减少研磨工具的负载 。
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公开(公告)号：US08939817B2
公开(公告)日：2015-01-27
申请号：US13482043
申请日：2012-05-29
申请人： Jun Ho Son
发明人： Jun Ho Son
CPC分类号： B24B37/30 , B24B41/061
摘要： Provided is a membrane assembly of a carrier head in a chemical-mechanical polishing apparatus. The membrane assembly includes a main membrane and a circular ring. The main membrane has a wafer contacting surface in contact with a wafer while a chemical-mechanical polishing process is being performed. The circular ring is disposed at an edge portion of the main membrane and receives an air pressure to downwardly apply the air pressure to the main membrane at the edge portion.
摘要翻译： 提供了一种在化学机械抛光装置中的载体头的膜组件。 膜组件包括主膜和圆环。 主要的膜具有与晶片接触的晶片接触表面，同时进行化学机械抛光工艺。 圆环设置在主膜的边缘部分处，并且接收空气压力以在边缘部分向下施加空气压力到主膜。
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公开(公告)号：US08939815B2
公开(公告)日：2015-01-27
申请号：US13031344
申请日：2011-02-21
申请人： Hui-Ting Tsai , Feng-Inn Wu
发明人： Hui-Ting Tsai , Feng-Inn Wu
摘要： A system includes a chuck with a retaining ring on a first surface thereof. The first surface and the retaining ring are both circular, the retaining ring having a first inner circumference. The system also includes a platen with a second surface, and the second surface faces the first surface and is operable to move with the first surface. The system further includes an air zone circumscribed by the first inner circumference that provides an effective inner circumference different from the first inner circumference.
摘要翻译： 系统包括在其第一表面上具有保持环的卡盘。 第一表面和保持环都是圆形的，保持环具有第一内圆周。 该系统还包括具有第二表面的压板，并且第二表面面向第一表面并且可操作以与第一表面一起移动。 该系统还包括由第一内周限定的空气区域，该空气区域提供不同于第一内圆周的有效内圆周。
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5.发明授权公开(公告)号：US08366514B2
公开(公告)日：2013-02-05
申请号：US12748109
申请日：2010-03-26
申请人： Satoru Ide , Moriyuki Kashiwa , Kazuo Kobayashi , Noriyuki Motimaru , Eiichi Yamamoto , Tomio Kubo , Hiroaki Kida
发明人： Satoru Ide , Moriyuki Kashiwa , Kazuo Kobayashi , Noriyuki Motimaru , Eiichi Yamamoto , Tomio Kubo , Hiroaki Kida
CPC分类号： B24B37/00
摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.
摘要翻译： 一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。 一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。 同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。
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公开(公告)号：US08137162B2
公开(公告)日：2012-03-20
申请号：US12075973
申请日：2008-03-14
IPC分类号： B24B5/02
CPC分类号： B24B37/105
摘要： Embodiments of the invention comprise a machine adapted for polishing work pieces such as large silicon wafers. A wafer polishing machine in accord with the invention comprises a rotatable platen in a table base, above which is mounted a lid having a head moving assembly with four synchronously rotatable head assemblies. A motor and linkage connected to the head moving assembly imparts reciprocating linear motion to the head assemblies in a selected direction in a plane parallel to an upper surface of the platen. Embodiments of the invention produce a complex relative motion between a surface of a wafer to be polished and the platen. The complex relative motion, resulting from a combination of motions including rotation of the platen, rotation of the head assemblies, and translation of the head moving assembly, improves a uniformity of polish and a rate of polishing compared to wafer polishing machines known in the art.
摘要翻译： 本发明的实施例包括适于抛光诸如大硅晶片的工件的机器。 根据本发明的晶片抛光机包括在台式基座中的可旋转压板，其上方安装有具有头部移动组件的盖子，该头部移动组件具有四个可同步旋转的头部组件。 连接到头部移动组件的电动机和联动装置在与压板的上表面平行的平面中沿着选定的方向向头部组件提供往复直线运动。 本发明的实施例在要抛光的晶片的表面和压板之间产生复杂的相对运动。 由包括台板的旋转，头部组件的旋转和头部移动组件的平移的运动的组合产生的复杂的相对运动与本领域已知的晶片抛光机相比提高了抛光的均匀性和抛光速率 。
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7.发明申请METHOD FOR GRINDING A MACHINE PART, AND GRINDING MACHINE FOR CARRYING OUT SAID METHOD 有权用于研磨机器部件的方法和用于实施方法的研磨机公开(公告)号：US20100048104A1
公开(公告)日：2010-02-25
申请号：US12449122
申请日：2008-02-27
申请人： Erwin Junker
发明人： Erwin Junker
CPC分类号： B24B5/12
摘要： Disclosed is a method for grinding a machine part that is used as a drive shaft, for example, rotates about the longitudinal axis thereof during the grinding process, and is provided with a journal at one axial end thereof and a recess at the opposite end thereof. The grinding process is carried out in one and the same grinding machine. In said grinding method, the machine part is brought into different clamped states by means of a chuck of a workpiece spindle head with releasable clamping jaws and a centering tip, a backrest, and/or a tailstock quill. Changing the clamped states has the advantage that the machine part remains in the same position in a single grinding machine, i.e. the clamped position, in all the different clamped states such that more accurate sizes, shapes, and positions can be obtained in an economical manner and all areas of the machine part which are to be ground are successively accessible to the grinding disks.
摘要翻译： 公开了一种用于研磨作为驱动轴的机器部件的方法，例如在研磨过程中围绕其纵向轴线旋转，并且在其一个轴向端部处设置有轴颈和在其相对端的凹部 。 研磨过程在同一台研磨机中进行。 在所述研磨方法中，通过具有可释放的夹钳爪和定心尖，靠背和/或尾座套筒的工件主轴头的卡盘将机器部件置于不同的夹紧状态。 改变夹紧状态具有以下优点：机器部件在单个研磨机中保持在相同的位置，即夹紧位置，处于所有不同的夹紧状态，从而可以以经济的方式获得更精确的尺寸，形状和位置 并且要研磨的机器部分的所有区域可以连续地接触到研磨盘。
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公开(公告)号：US06887128B2
公开(公告)日：2005-05-03
申请号：US10476114
申请日：2002-01-07
CPC分类号： B24B49/14 , B23Q11/0003 , B24B5/02 , B24B47/22
摘要： The invention provides a method of reducing thermal distortion in grinding machines. Such machines each comprise a machine base (60) and a grinding wheel (50) for grinding components in the machine (10). The method includes the steps of: (a) sensing a first temperature at an upper surface of the base (60) substantially below a position (110) in the machine (10) whereat component grinding using the wheel (50) occurs; (b) sensing a second temperature of an underside surface of the base (60) substantially below the position (110) whereat component grinding occurs; (c) determining a relationship between component size drift and changes in a difference between the first and second temperatures; and thereafter (d) correcting a positional offset applied to the wheel (50) during grinding in accordance with the determined relationship, thereby reducing the component size drift. Preferably, the relationship is substantially a linear function of the form MDS=Kf(ΔT1−ΔT2) although higher-order polynom be applied if required. The invention also relates to grinding machines (10) employing the method of reducing thermal distortion.
摘要翻译： 本发明提供一种降低磨床热变形的方法。 这些机器各自包括用于研磨机器（10）中的部件的机器基座（60）和砂轮（50）。 该方法包括以下步骤：（a）感测基座（60）的上表面上的第一温度，其基本上在机器（10）的位置（110）下方，其中发生使用轮（50）的部件磨削; （b）感测基部（60）的下表面的第二温度基本上在发生部件磨削的位置（110）的下方; （c）确定部件尺寸漂移与第一和第二温度之差的变化之间的关系; 之后（d）根据确定的关系校正在磨削期间施加到车轮（50）的位置偏移，从而减小部件尺寸漂移。 优选地，该关系基本上是形式MDS = Kψ（ΔT1 -T 2 -T 2 2）的线性函数，尽管高阶多项式为 如果需要的话。 本发明还涉及采用减少热变形的方法的研磨机（10）。
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公开(公告)号：US06884204B2
公开(公告)日：2005-04-26
申请号：US10644788
申请日：2003-08-21
申请人： Noboru Watanabe
发明人： Noboru Watanabe
CPC分类号： B23Q17/2291 , B23Q3/152 , B23Q3/183 , B23Q2230/002 , Y10T409/303864 , Y10T409/306944 , Y10T409/309408 , Y10T409/30952 , Y10T483/14
摘要： A machine tool comprises: a workpiece spindle (12) having an electromagnetic chuck (18) provided on an upper end thereof for clamping a workpiece (W), and extending along the Z-axis; a tool magazine which accommodates a tool (T) and a centering jig (20); an automatic tool changer (17) for exchanging the tool (T) between the tool magazine and a tool spindle; and a run-out measuring device (19) for measuring a run-out of the workpiece (W) placed on the electromagnetic chuck (18); wherein a workpiece correction distance is calculated on the basis of the run-out of the workpiece (W) measured by the run-out measuring device (19) before the workpiece (W) is clamped by the electromagnetic chuck (18), and a workpiece centering operation is automatically performed by the centering jig (20) attached to the tool spindle until the run-out of the workpiece (W) falls within an allowable range.
摘要翻译： 一种机床包括：工件轴（12），具有设置在其上端的电磁卡盘（18），用于夹紧工件（W）并沿Z轴延伸; 容纳工具（T）和定心夹具（20）的工具箱; 自动换刀器（17），用于在所述刀库与刀具主轴之间更换刀具（T）; 以及用于测量放置在所述电磁卡盘（18）上的所述工件（W）的跳动的跳动测量装置（19）。 其特征在于，在由所述电磁卡盘（18）夹持所述工件（W）之前，基于由所述断出测量装置（19）测量的所述工件（W）的跳动量来计算工件校正距离， 通过安装在工具主轴上的对中夹具（20）自动执行工件对中操作，直到工件（W）的跳出落在容许范围内。
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公开(公告)号：US06012976A
公开(公告)日：2000-01-11
申请号：US843934
申请日：1997-04-17
CPC分类号： B24B5/50 , B24B41/062 , B24B5/02 , B24B5/04 , Y10T82/10
摘要： Improved chucks for supporting elongate objects having conical end portions, such as single crystal ingots of semiconductor material, while such objects are held and rotated, as in a lathe. A base portion of the chuck includes bores to accept fasteners to fasten the base to a headstock or tailstock of a lathe. The base includes a receptacle for holding an annular chuck insert which has a conical socket surface to engage the body, such as a conical end portion of a single crystal ingot, to be held and rotated. Alternatively, the base may have three or more rollers spaced equally about a central axis and rotatable about roller axes all located in a plane perpendicular to the central axis.
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