公开(公告)号：US4777061A

公开(公告)日：1988-10-11

申请号：US132739

申请日：1987-12-14

申请人： Schyi-yi Wu ,  J. B. Price ,  John Mendonca ,  Yu Chang Chow

发明人： Schyi-yi Wu ,  J. B. Price ,  John Mendonca ,  Yu Chang Chow

IPC分类号： C23C16/14 ,  C23C16/50 ,  B05D3/06

CPC分类号： C23C16/14

摘要： A process is disclosed for depositing tungsten non-selectively on conductors and dielectrics without the use of an adhesive interlayer. The process comprises an argon pre-treatment followed by low power plasma deposition to nucleate the tungsten. A thick, adherent layer of tungsten is then deposited.

摘要翻译： 公开了一种在不使用粘合剂中间层的情况下在导体和电介质上非选择性地沉积钨的方法。 该方法包括氩预处理，随后进行低功率等离子体沉积以使钨成核。 然后沉积厚的粘附层钨。

公开(公告)号：US4737474A

公开(公告)日：1988-04-12

申请号：US931479

申请日：1986-11-17

申请人： J. B. Price ,  Yu C. Chow ,  John Mendonca ,  Schyi-Yi Wu

发明人： J. B. Price ,  Yu C. Chow ,  John Mendonca ,  Schyi-Yi Wu

IPC分类号： H01L21/3205 ,  H01L21/28 ,  H01L23/52 ,  H01L29/78

CPC分类号： H01L21/28026 ,  H01L21/28061 ,  Y10S148/147

摘要： A process for forming a bonding layer comprising amorphous silicon, titanium, chromium, or tungsten, between the silicide and the N+ polysilicon layer is disclosed. The bonding layer is preferably less than 50 nm. thick. After the bonding layer is deposited, a silicide layer is deposited and the wafer is then sintered at 900.degree.-1000.degree. C. for ten minutes or less.

公开(公告)号：US4749597A

公开(公告)日：1988-06-07

申请号：US109635

申请日：1987-10-19

申请人： John Mendonca ,  J. B. Price ,  Richard S. Rosler

发明人： John Mendonca ,  J. B. Price ,  Richard S. Rosler

IPC分类号： C23C16/02 ,  C23C16/56 ,  H01L21/285 ,  C23C16/08

CPC分类号： C23C16/56 ,  C23C16/0281 ,  H01L21/28568

摘要： A process is disclosed for reducing lateral encroachment and silicon consumption in LPCVD of tungsten. The process comprises a low temperature deposition of a thin layer of tungsten, followed by annealing in nitrogen at high temperature, follows by deposition of a thick layer of tungsten.

摘要翻译： 公开了一种减少钨的LPCVD中的横向侵蚀和硅消耗的方法。 该方法包括钨的薄层的低温沉积，然后在氮气中在高温下进行退火，随后沉积厚层的钨。

公开(公告)号：US06444569B1

公开(公告)日：2002-09-03

申请号：US09835276

申请日：2001-04-16

申请人： Janos Farkas ,  Brian G. Anthony ,  Abbas Guvenilir ,  Mohammed Rabiul Islam ,  Venkat Kolagunta ,  John Mendonca ,  Rajesh Tiwari ,  Suresh Venkatesan

发明人： Janos Farkas ,  Brian G. Anthony ,  Abbas Guvenilir ,  Mohammed Rabiul Islam ,  Venkat Kolagunta ,  John Mendonca ,  Rajesh Tiwari ,  Suresh Venkatesan

IPC分类号： H01L214763

摘要： A copper interconnect polishing process begins by polishing (17) a bulk thickness of copper (63) using a first platen. A second platen is then used to remove (19) a thin remaining interfacial copper layer to expose a barrier film (61). Computer control (21) monitors polish times of the first and second platen and adjusts these times to improve wafer throughput. One or more platens and/or the wafer is rinsed (20) between the interfacial copper polish and the barrier polish to reduce slurry cross contamination. A third platen and slurry is then used to polish away exposed portions of the barrier (61) to complete polishing of the copper interconnect structure. A holding tank that contains anti-corrosive fluid is used to queue the wafers until subsequent scrubbing operations (25). A scrubbing operation (25) that is substantially void of light is used to reduce photovoltaic induced corrosion of copper in the drying chamber of the scubber.

公开(公告)号：US06274478B1

公开(公告)日：2001-08-14

申请号：US09352136

申请日：1999-07-13

申请人： Janos Farkas ,  Brian G. Anthony ,  Abbas Guvenilir ,  Mohammed Rabiul Islam ,  Venkat Kolagunta ,  John Mendonca ,  Rajesh Tiwari ,  Suresh Venkatesan

发明人： Janos Farkas ,  Brian G. Anthony ,  Abbas Guvenilir ,  Mohammed Rabiul Islam ,  Venkat Kolagunta ,  John Mendonca ,  Rajesh Tiwari ,  Suresh Venkatesan

IPC分类号： H01L214763

CPC分类号： H01L21/7684 ,  H01L21/02074 ,  H01L21/31053 ,  H01L21/3212

摘要： A copper interconnect polishing process begins by polishing (17) a bulk thickness of copper (63) using a first platen. A second platen is then used to remove (19) a thin remaining interfacial copper layer to expose a barrier film (61). Computer control (21) monitors polish times of the first and second platen and adjusts these times to improve wafer throughput. One or more platens and/or the wafer is rinsed (20) between the interfacial copper polish and the barrier polish to reduce slurry cross contamination. A third platen and slurry is then used to polish away exposed portions of the barrier (61) to complete polishing of the copper interconnect structure. A holding tank that contains anti-corrosive fluid is used to queue the wafers until subsequent scrubbing operations (25). A scrubbing operation (25) that is substantially void of light is used to reduce photovoltaic induced corrosion of copper in the drying chamber of the scrubber.

摘要翻译： 铜互连抛光工艺通过使用第一压板抛光（17）铜（63）的体积厚度开始。 然后使用第二压板来去除（19）薄的剩余界面铜层以暴露阻挡膜（61）。 计算机控制（21）监测第一和第二压板的抛光时间并调整这些时间以提高晶片的吞吐量。 一个或多个压板和/或晶片在界面铜抛光剂和阻隔抛光剂之间漂洗（20），以减少淤浆交叉污染。 然后使用第三压板和浆料抛光掉屏障（61）的暴露部分以完成铜互连结构的抛光。 使用含有防腐蚀液体的储存罐将晶片排队，直到后续的擦洗操作（25）。 使用基本上无光的擦洗操作（25）用于减少洗涤器的干燥室中的铜的光伏诱发的腐蚀。

公开(公告)号：US07523503B2

公开(公告)日：2009-04-21

申请号：US10349423

申请日：2003-01-21

申请人： John Mendonca ,  Bryan Stephenson

发明人： John Mendonca ,  Bryan Stephenson

IPC分类号： G06F11/30 ,  G08B29/00 ,  G08B23/00 ,  G06F12/14

CPC分类号： H04L63/1416 ,  G06F21/316 ,  H04L43/00

摘要： A method for providing security for a network intrusion detection system in a provisionable network, the method comprises evaluating the system security of the provisionable network and applying a system lockdown in the provisionable network in accordance with the results of the evaluation.

摘要翻译： 一种用于为可配置网络中的网络入侵检测系统提供安全性的方法，所述方法包括：根据评估结果评估所述可配置网络的系统安全性并在所述可配置网络中应用系统锁定。

公开(公告)号：US20060089986A1

公开(公告)日：2006-04-27

申请号：US10975278

申请日：2004-10-27

申请人： John Mendonca

发明人： John Mendonca

IPC分类号： G06F15/173

CPC分类号： G06F21/604 ,  G06F2221/2105 ,  G06F2221/2147

摘要： A method and system for processing concurrent events in a provisional network that comprises a plurality of dynamically allocatable nodes. Specifically, the method includes receiving notification of an event associated with a node in the provisional network. The event requires processing a new lifecycle operation to update a status of the node in the provisional network. Then, it is determined whether the node is locked for processing an active lifecycle operation that is associated with a concurrent event for the node. Processing of the new lifecycle operation is suspended until the active lifecycle operation has terminated, if the node is locked. The lock is maintained on the node after the active lifecycle operation has terminated. Thereafter, the new lifecycle operation is processed when the active lifecycle operation has terminated.

公开(公告)号：US20050022022A1

公开(公告)日：2005-01-27

申请号：US10627017

申请日：2003-07-25

申请人： John Mendonca ,  Amit Raikar

发明人： John Mendonca ,  Amit Raikar

IPC分类号： G06F11/30 ,  G06F21/00 ,  H04L12/24 ,  H04L12/26 ,  H04L29/06

CPC分类号： H04L63/20 ,  G06F21/55 ,  H04L63/1416

摘要： A method of managing utilization of network intrusion detection systems in a dynamic data center is provided. A plurality of network intrusion detection systems are provided, each being networked so that utilization of each network intrusion detection system can be based on demand for the network intrusion detection systems in the dynamic data center. A monitoring policy and a plurality of monitoring points to be monitored on a network with any of the network intrusion detection systems are received. Further, the monitoring of the monitoring points is automatically arranged using the network intrusion detection systems and the monitoring policy.

摘要翻译： 提供了一种在动态数据中心中管理网络入侵检测系统的利用的方法。 提供了多个网络入侵检测系统，每个网络入侵检测系统被联网，使得每个网络入侵检测系统的利用可以基于对动态数据中心中的网络入侵检测系统的需求。 接收监视策略和多个监视点，以便在任何一个网络入侵检测系统的网络上监控。 此外，使用网络入侵检测系统和监控策略自动布置监控点的监控。

公开(公告)号：US06573173B2

公开(公告)日：2003-06-03

申请号：US10175637

申请日：2002-06-20

申请人： Janos Farkas ,  Brian G. Anthony ,  Abbas Guvenilir ,  Mohammed Rabiul Islam ,  Venkat Kolagunta ,  John Mendonca ,  Rajesh Tiwari ,  Suresh Venkatesan

发明人： Janos Farkas ,  Brian G. Anthony ,  Abbas Guvenilir ,  Mohammed Rabiul Islam ,  Venkat Kolagunta ,  John Mendonca ,  Rajesh Tiwari ,  Suresh Venkatesan

IPC分类号： H01L214763

CPC分类号： H01L21/7684 ,  H01L21/02074 ,  H01L21/3212

摘要： A copper interconnect polishing process begins by polishing (17) a bulk thickness of copper (63) using a first platen. A second platen is then used to remove (19) a thin remaining interfacial copper layer to expose a barrier film (61). Computer control (21) monitors polish times of the first and second platen and adjusts these times to improve wafer throughput. One or more platens and/or the wafer is rinsed (20) between the interfacial copper polish and the barrier polish to reduce slurry cross contamination. A third platen and slurry is then used to polish away exposed portions of the barrier (61) to complete polishing of the copper interconnect structure. A holding tank that contains anti-corrosive fluid is used to queue the wafers until subsequent scrubbing operations (25). A scrubbing operation (25) that is substantially void of light is used to reduce photovoltaic induced corrosion of copper in the drying chamber of the scubber.

公开(公告)号：US08533828B2

公开(公告)日：2013-09-10

申请号：US10349385

申请日：2003-01-21

申请人： John Mendonca ,  Amit Raikar ,  Bryan Stephenson

发明人： John Mendonca ,  Amit Raikar ,  Bryan Stephenson

IPC分类号： H04L29/06

CPC分类号： H04L63/0272 ,  H04L63/0218 ,  H04L63/1416

摘要： Disclosed is a system for protecting security of a provisionable network, comprising: a network server, a network client communicatively coupled with the server, a pool of resources coupled with the server for employment by the client, a resource management system for managing the resources, and an intrusion detection system enabled to detect and respond to an intrusion in said network.

摘要翻译： 公开了一种用于保护可配置网络的安全性的系统，包括：网络服务器，与服务器通信地耦合的网络客户端，与服务器耦合的资源池，供客户使用;资源管理系统，用于管理资源; 以及能够检测和响应所述网络中的入侵的入侵检测系统。