公开(公告)号：US11548781B2

公开(公告)日：2023-01-10

申请号：US16759659

申请日：2018-11-16

Applicant: Sciosense B.V.

Inventor： Casper Van Der Avoort ,  Willem Frederik Adrianus Besling ,  Remco Henricus Wilhelmus Pijnenburg ,  Olaf Wunnicke ,  Coen Tak

IPC: B81B7/00 ,  B81B7/02 ,  G01L9/00 ,  H04R1/04 ,  H04R19/04

Abstract: A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.