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1.发明授权Anti-tamper enclosure system comprising a photosensitive sensor and optical medium 失效防篡改封闭系统，包括光敏传感器和光学介质公开(公告)号：US07671324B2
公开(公告)日：2010-03-02
申请号：US11859466
申请日：2007-09-21
CPC分类号： G08B13/1481 , G01R31/31708 , G01R31/31728 , G06F21/86 , H05K1/0274 , H05K1/0275 , H05K5/0208 , H05K2201/10151
摘要： An anti-tamper enclosure system comprises an optical medium; at least one photosensitive sensor configured to measure at least one characteristic of a light wave transmitted in the optical medium; at least one logic circuit coupled to the at least one photosensitive sensor, the at least one logic circuit configured to initiate security measures when the at least one characteristic of the light wave changes; an enclosure coupled to the optical medium and configured to enclose the optical medium, the at least one photosensitive sensor, and the at least one logic circuit; and a plurality of attachment posts configured to be coupled to a printed circuit board, wherein at least one of the plurality of attachment posts is also coupled to the optical medium.
摘要翻译： 防篡改封闭系统包括光学介质; 至少一个感光传感器被配置为测量在光学介质中传输的光波的至少一个特性; 耦合到所述至少一个光敏传感器的至少一个逻辑电路，所述至少一个逻辑电路被配置为当所述光波的所述至少一个特性改变时发起安全措施; 耦合到所述光学介质并被配置为包围所述光学介质，所述至少一个光敏传感器和所述至少一个逻辑电路的外壳; 以及多个附接柱，其被配置为联接到印刷电路板，其中所述多个连接柱中的至少一个还耦合到所述光学介质。
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公开(公告)号：US20080192240A1
公开(公告)日：2008-08-14
申请号：US11672642
申请日：2007-02-08
IPC分类号： G01N21/00
CPC分类号： G01M11/3109 , G06F21/87 , G06F2221/2101 , G06F2221/2143 , G08B13/186
摘要： A method of recognizing a tamper event is provided. The method uses an optical medium having a unique signature, and transmits at least one light wave into the optical medium. The light wave is altered by the unique signature of the optical medium and at least one property of the light wave is measured. Access to at least a portion of a system is conditioned based on the at least one property of the light wave.
摘要翻译： 提供了识别篡改事件的方法。 该方法使用具有唯一签名的光学介质，并将至少一个光波发送到光学介质中。 光波被光学介质的独特标记改变，并且测量光波的至少一个性质。 基于光波的至少一个属性来调节对系统的至少一部分的访问。
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公开(公告)号：US08284387B2
公开(公告)日：2012-10-09
申请号：US11672642
申请日：2007-02-08
IPC分类号： G01N21/00
CPC分类号： G01M11/3109 , G06F21/87 , G06F2221/2101 , G06F2221/2143 , G08B13/186
摘要： A method of recognizing a tamper event is provided. The method uses an optical medium having a unique signature, and transmits at least one light wave into the optical medium. The light wave is altered by the unique signature of the optical medium and at least one property of the light wave is measured. Access to at least a portion of a system is conditioned based on the at least one property of the light wave.
摘要翻译： 提供了识别篡改事件的方法。 该方法使用具有唯一签名的光学介质，并将至少一个光波发送到光学介质中。 光波被光学介质的独特标记改变，并且测量光波的至少一个性质。 基于光波的至少一个属性来调节对系统的至少一部分的访问。
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公开(公告)号：US20080073491A1
公开(公告)日：2008-03-27
申请号：US11859466
申请日：2007-09-21
IPC分类号： B60Q1/00
CPC分类号： G08B13/1481 , G01R31/31708 , G01R31/31728 , G06F21/86 , H05K1/0274 , H05K1/0275 , H05K5/0208 , H05K2201/10151
摘要： An anti-tamper enclosure system comprises an optical medium; at least one photosensitive sensor configured to measure at least one characteristic of a light wave transmitted in the optical medium; at least one logic circuit coupled to the at least one photosensitive sensor, the at least one logic circuit configured to initiate security measures when the at least one characteristic of the light wave changes; an enclosure coupled to the optical medium and configured to enclose the optical medium, the at least one photosensitive sensor, and the at least one logic circuit; and a plurality of attachment posts configured to be coupled to a printed circuit board, wherein at least one of the plurality of attachment posts is also coupled to the optical medium.
摘要翻译： 防篡改封闭系统包括光学介质; 至少一个感光传感器被配置为测量在光学介质中传输的光波的至少一个特性; 耦合到所述至少一个光敏传感器的至少一个逻辑电路，所述至少一个逻辑电路被配置为当所述光波的所述至少一个特性改变时发起安全措施; 耦合到所述光学介质并被配置为包围所述光学介质，所述至少一个光敏传感器和所述至少一个逻辑电路的外壳; 以及多个附接柱，其被配置为联接到印刷电路板，其中所述多个连接柱中的至少一个还耦合到所述光学介质。
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公开(公告)号：US08710618B2
公开(公告)日：2014-04-29
申请号：US11685029
申请日：2007-03-12
IPC分类号： H01L21/70
CPC分类号： H01L23/3121 , H01L23/295 , H01L23/3135 , H01L23/585 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer.
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公开(公告)号：US20080227302A1
公开(公告)日：2008-09-18
申请号：US11685029
申请日：2007-03-12
IPC分类号： H01L21/31
CPC分类号： H01L23/3121 , H01L23/295 , H01L23/3135 , H01L23/585 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： an integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer.
摘要翻译： 提供了具有纤维界面的集成电路（IC）封装。 该包装包括基材，粘合涂层和顶涂层。 基板被配置为包含IC部件和连接。 接合涂层被配置为封装IC部件。 顶涂层具有至少一部分嵌入粘合涂层中的部分。 此外，顶涂层包括被配置为提供安全性并加强粘合涂层的纤维界面。
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