Methods of processing substrates
    1.
    发明授权
    Methods of processing substrates 有权
    处理基板的方法

    公开(公告)号:US08728721B2

    公开(公告)日:2014-05-20

    申请号:US13205004

    申请日:2011-08-08

    IPC分类号: G03F7/20

    CPC分类号: G03F7/0035

    摘要: A method of processing a substrate includes forming first photoresist on a substrate. A portion of the first photoresist is selectively exposed to actinic energy and then the first photoresist is negative tone developed to remove an unexposed portion of the first photoresist. Second photoresist is formed on the substrate over the developed first photoresist. A portion of the second photoresist is selectively exposed to actinic energy and then the second photoresist is negative tone developed to remove an unexposed portion of the second photoresist and form a pattern on the substrate which comprises the developed first photoresist and the developed second photoresist. Other implementations are disclosed.

    摘要翻译: 一种处理衬底的方法包括在衬底上形成第一光致抗蚀剂。 第一光致抗蚀剂的一部分选择性地暴露于光化能,然后第一光致抗蚀剂显影为负色调以除去第一光致抗蚀剂的未曝光部分。 在显影的第一光致抗蚀剂上的基底上形成第二光致抗蚀剂。 第二光致抗蚀剂的一部分选择性地暴露于光化能,然后第二光致抗蚀剂显色以除去第二光致抗蚀剂的未曝光部分,并在包含显影的第一光致抗蚀剂和显影的第二光致抗蚀剂的基板上形成图案。 公开了其他实现。

    Methods Of Processing Substrates
    2.
    发明申请
    Methods Of Processing Substrates 有权
    基板加工方法

    公开(公告)号:US20130040245A1

    公开(公告)日:2013-02-14

    申请号:US13205004

    申请日:2011-08-08

    IPC分类号: G03F7/20

    CPC分类号: G03F7/0035

    摘要: A method of processing a substrate includes forming first photoresist on a substrate. A portion of the first photoresist is selectively exposed to actinic energy and then the first photoresist is negative tone developed to remove an unexposed portion of the first photoresist. Second photoresist is formed on the substrate over the developed first photoresist. A portion of the second photoresist is selectively exposed to actinic energy and then the second photoresist is negative tone developed to remove an unexposed portion of the second photoresist and form a pattern on the substrate which comprises the developed first photoresist and the developed second photoresist. Other implementations are disclosed.

    摘要翻译: 一种处理衬底的方法包括在衬底上形成第一光致抗蚀剂。 第一光致抗蚀剂的一部分选择性地暴露于光化能,然后第一光致抗蚀剂显影为负色调以除去第一光致抗蚀剂的未曝光部分。 在显影的第一光致抗蚀剂上的基底上形成第二光致抗蚀剂。 第二光致抗蚀剂的一部分选择性地暴露于光化能,然后第二光致抗蚀剂显色以除去第二光致抗蚀剂的未曝光部分,并在包含显影的第一光致抗蚀剂和显影的第二光致抗蚀剂的基板上形成图案。 公开了其他实现。