LIGHT EMITTING DIODES AND ASSOCIATED METHODS OF MANUFACTURING
    5.
    发明申请
    LIGHT EMITTING DIODES AND ASSOCIATED METHODS OF MANUFACTURING 有权
    发光二极管及相关制造方法

    公开(公告)号:US20110193115A1

    公开(公告)日:2011-08-11

    申请号:US12703660

    申请日:2010-02-10

    IPC分类号: H01L33/00

    摘要: Light emitting diodes and associated methods of manufacturing are disclosed herein. In one embodiment, a light emitting diode (LED) includes a substrate, a semiconductor material carried by the substrate, and an active region proximate to the semiconductor material. The semiconductor material has a first surface proximate to the substrate and a second surface opposite the first surface. The second surface of the semiconductor material is generally non-planar, and the active region generally conforms to the non-planar second surface of the semiconductor material.

    摘要翻译: 本文公开了发光二极管和相关的制造方法。 在一个实施例中,发光二极管(LED)包括衬底,由衬底承载的半导体材料和靠近半导体材料的有源区。 半导体材料具有靠近基板的第一表面和与第一表面相对的第二表面。 半导体材料的第二表面通常是非平面的,并且有源区域通常符合半导体材料的非平面第二表面。