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公开(公告)号：US20160381834A1
公开(公告)日：2016-12-29
申请号：US14751488
申请日：2015-06-26
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
CPC classification number: H05K7/20627 , F16L37/146 , F16L37/18 , F16L37/32 , F28F3/12 , F28F9/0075 , F28F9/02 , F28F9/0219 , F28F9/0275 , F28F2280/10 , G06F1/20 , G06F2200/201 , H05K7/20636 , H05K7/20781
Abstract: Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate.
Abstract translation: 本文提供了用于冷却安装在设备机架中的电子部件的模块化冷却系统的技术。 模块化冷却系统包括冷板和连接到冷板的支撑歧管。 一起，支撑歧管和冷板限定了用于将流体从支撑歧管冷却到冷板的流体路径。 模块化冷却系统还包括设备载体，包括由冷板冷却的设备。
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公开(公告)号：US09655281B2
公开(公告)日：2017-05-16
申请号：US14751488
申请日：2015-06-26
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
CPC classification number: H05K7/20627 , F16L37/146 , F16L37/18 , F16L37/32 , F28F3/12 , F28F9/0075 , F28F9/02 , F28F9/0219 , F28F9/0275 , F28F2280/10 , G06F1/20 , G06F2200/201 , H05K7/20636 , H05K7/20781
Abstract: Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate.
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公开(公告)号：US09832906B2
公开(公告)日：2017-11-28
申请号：US14751498
申请日：2015-06-26
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
IPC: H01R27/02 , H01R13/213 , H05K7/14 , G06F1/16
CPC classification number: H05K7/1492 , G06F1/16 , H01R13/213
Abstract: Technologies for midplane docking systems for connecting adjacent levels of docks are provided herein. An extendable connection system includes: a connector cable, the connector cable having a first end and a second end; a male connector, the male connector connected to the first end of the connector cable, the male connector including male connecting mechanism; and a female connector, the female connector connected to the second end of the connector cable and including a female connecting mechanism adapted to connect with the male connecting mechanism, wherein the male connector is extendable relative to the female connector.
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Patent Agency Ranking
公开(公告)号：US20160380399A1
公开(公告)日：2016-12-29
申请号：US14751498
申请日：2015-06-26
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
IPC: H01R27/02
CPC classification number: H05K7/1492 , G06F1/16 , H01R13/213
Abstract: Technologies for midplane docking systems for connecting adjacent levels of docks are provided herein. An extendable connection system includes: a connector cable, the connector cable having a first end and a second end; a male connector, the male connector connected to the first end of the connector cable, the male connector including male connecting mechanism; and a female connector, the female connector connected to the second end of the connector cable and including a female connecting mechanism adapted to connect with the male connecting mechanism, wherein the male connector is extendable relative to the female connector.
Abstract translation: 本文提供了用于连接相邻水平底座的中平面对接系统的技术。 可延伸连接系统包括：连接器电缆，所述连接器电缆具有第一端和第二端; 阳连接器，阳连接器连接到连接器电缆的第一端，阳连接器包括阳连接机构; 和阴连接器，阴连接器连接到连接器电缆的第二端并且包括适于与阳连接机构连接的阴连接机构，其中阳连接器可相对于阴连接器延伸。
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公开(公告)号：US11197393B2
公开(公告)日：2021-12-07
申请号：US16407256
申请日：2019-05-09
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
Abstract: A method for assembling a modular cooling system includes attaching a support manifold to a first rail of an equipment rack, the support manifold defining a coolant supply channel and a coolant return channel; and mounting a first cold plate to the support manifold including engaging a manifold supply connector with a plate supply connector in fluid communication, the manifold supply connector being connected in fluid communication with the coolant supply channel of the support manifold, the plate supply connector being connected in fluid communication with a cooling system disposed within the first cold plate.
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公开(公告)号：US20190269039A1
公开(公告)日：2019-08-29
申请号：US16407256
申请日：2019-05-09
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
Abstract: A method for assembling a modular cooling system includes attaching a support manifold to a first rail of an equipment rack, the support manifold defining a coolant supply channel and a coolant return channel; and mounting a first cold plate to the support manifold including engaging a manifold supply connector with a plate supply connector in fluid communication, the manifold supply connector being connected in fluid communication with the coolant supply channel of the support manifold, the plate supply connector being connected in fluid communication with a cooling system disposed within the first cold plate.
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公开(公告)号：US10327358B2
公开(公告)日：2019-06-18
申请号：US15595779
申请日：2017-05-15
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
Abstract: Methods, apparatuses, and systems for fluid connections in modular cooling systems for cooling electronic components installed in equipment racks. A cold plate is positioned adjacent to a support manifold in a mated position, where the cold plate comprises a plate connector. The plate connector comprises a plate outer sleeve and defines a central passageway. The support manifold comprises a manifold connector, which comprises a manifold outer sleeve and defines a central passageway. An outer surface of the manifold outer sleeve is positioned adjacent to an outer surface of the plate outer sleeve. A cam is rotated about a pivot pin and engages with a plate retainer to secure the cold plate against the support manifold, and the central passageway of the plate connector is connected in fluid communication with the central passageway of the manifold connector.
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公开(公告)号：US20170251573A1
公开(公告)日：2017-08-31
申请号：US15595779
申请日：2017-05-15
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
CPC classification number: H05K7/20627 , F16L37/146 , F16L37/18 , F16L37/32 , F28F3/12 , F28F9/0075 , F28F9/02 , F28F9/0219 , F28F9/0275 , F28F2280/10 , G06F1/20 , G06F2200/201 , H05K7/20636 , H05K7/20781
Abstract: Methods, apparatuses, and systems for fluid connections in modular cooling systems for cooling electronic components installed in equipment racks. A cold plate is positioned adjacent to a support manifold in a mated position, where the cold plate comprises a plate connector. The plate connector comprises a plate outer sleeve and defines a central passageway. The support manifold comprises a manifold connector, which comprises a manifold outer sleeve and defines a central passageway. An outer surface of the manifold outer sleeve is positioned adjacent to an outer surface of the plate outer sleeve. A cam is rotated about a pivot pin and engages with a plate retainer to secure the cold plate against the support manifold, and the central passageway of the plate connector is connected in fluid communication with the central passageway of the manifold connector.
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