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Patent Agency Ranking
公开(公告)号：US20140362515A1
公开(公告)日：2014-12-11
申请号：US14076515
申请日：2013-11-11
Applicant: Seagate Technology LLC
Inventor： Anthony John Pronozuk , Shawn Jacob Noland , James Edward Dykes , William Leon Rugg , Chau Chin Low
CPC classification number: H05K7/1488 , H05K7/1487 , H05K7/1491
Abstract: Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed housing is provided with opposing first and second ends. Sleds are individually movable between a retracted position within the enclosed housing and an extended position in which the sled projects from the first end. Each sled supports a group of processing devices. A control board is disposed within the enclosed housing adjacent the second end. A plurality of flex circuits contactingly engage the processing devices to provide communication paths between the processing devices and the control board in both the retracted and extended positions of the sleds.
Abstract translation: 一种用于在多设备外壳中缩回和扩展操作处理设备的设备。 根据一些实施例，封闭的壳体设置有相对的第一和第二端。 滑雪板可以在封闭的壳体内的缩回位置和从第一端突出的延伸位置之间单独移动。 每个雪橇支持一组处理设备。 控制板设置在与第二端相邻的封闭壳体内。 多个柔性电路与处理装置接触地接合，以在滑架的缩回位置和延伸位置两者之间提供处理装置与控制板之间的连通路径。
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公开(公告)号：US20220085534A1
公开(公告)日：2022-03-17
申请号：US17024115
申请日：2020-09-17
Applicant: Seagate Technology LLC
Inventor： Brian Lee Burski , Ted R. McDonald , Chau Chin Low
IPC: H01R12/79 , H01R13/622
Abstract: A connector includes a flexible connector having a first plurality of solder bumps arranged in a first pattern, and a base connector having a second plurality of solder bumps arranged in a second pattern concentric with and of a different size than the first pattern. A method of interconnecting a flexible connector to a base connector includes providing the flexible connector with a first plurality of solder bumps arranged in a first pattern, and providing the base connector with a second plurality of solder bumps arranged in a second pattern. The flexible and base connectors are aligned by aligning the first and second pluralities of solder bumps.
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公开(公告)号：US11387583B2
公开(公告)日：2022-07-12
申请号：US17024115
申请日：2020-09-17
Applicant: Seagate Technology LLC
Inventor： Brian Lee Burski , Ted R. McDonald , Chau Chin Low
IPC: H01R12/79 , H01R13/622
Abstract: A connector includes a flexible connector having a first plurality of solder bumps arranged in a first pattern, and a base connector having a second plurality of solder bumps arranged in a second pattern concentric with and of a different size than the first pattern. A method of interconnecting a flexible connector to a base connector includes providing the flexible connector with a first plurality of solder bumps arranged in a first pattern, and providing the base connector with a second plurality of solder bumps arranged in a second pattern. The flexible and base connectors are aligned by aligning the first and second pluralities of solder bumps.
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公开(公告)号：US09747934B1
公开(公告)日：2017-08-29
申请号：US15264387
申请日：2016-09-13
Applicant: SEAGATE TECHNOLOGY LLC
Inventor： Todd M. Lammers , Andrew R. Motzko , Chau Chin Low , Matthew S. Graeff
CPC classification number: G11B5/4846 , G11B5/09 , H05K1/0227 , H05K1/0245 , H05K1/0253 , H05K2201/09727
Abstract: Systems and methods for a flexible dynamic loop having reduced impedance are described. The flexible dynamic loop may supply current from a preamplifier to another device, such as a hard disk drive. In one embodiment, a flexible dynamic loop comprises a flexible structure having a set of wire traces. The flexible dynamic loop may also comprise a set of impedance control structures on the flexible structure and perpendicular to a bend radius of the flexible structure, wherein the set of impedance control structures change an impedance level experienced by at least some of the set of wire traces. Some of the impedance control structures may be staggered. The flexible dynamic loop may also include a cover layer formed over the set of impedance control structures, which may be patterned with perforations. The flexible dynamic loop may also include one or more flexible rails connecting some of the impedance control structures.
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公开(公告)号：US09468126B2
公开(公告)日：2016-10-11
申请号：US14076515
申请日：2013-11-11
Applicant: Seagate Technology LLC
Inventor： Anthony John Pronozuk , Shawn Jacob Noland , James Edward Dykes , William Leon Rugg , Chau Chin Low
IPC: H05K7/14
CPC classification number: H05K7/1488 , H05K7/1487 , H05K7/1491
Abstract: Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed housing is provided with opposing first and second ends. Sleds are individually movable between a retracted position within the enclosed housing and an extended position in which the sled projects from the first end. Each sled supports a group of processing devices. A control board is disposed within the enclosed housing adjacent the second end. A plurality of flex circuits contactingly engage the processing devices to provide communication paths between the processing devices and the control board in both the retracted and extended positions of the sleds.
Abstract translation: 一种用于在多设备外壳中缩回和扩展操作处理设备的设备。 根据一些实施例，封闭的壳体设置有相对的第一和第二端。 滑雪板可以在封闭的壳体内的缩回位置和从第一端突出的延伸位置之间单独移动。 每个雪橇支持一组处理设备。 控制板设置在与第二端相邻的封闭壳体内。 多个柔性电路与处理装置接触地接合，以在滑架的缩回位置和延伸位置两者之间提供处理装置与控制板之间的连通路径。
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