公开(公告)号：US11715895B2

公开(公告)日：2023-08-01

申请号：US16925020

申请日：2020-07-09

Applicant: Seagate Technology LLC

Inventor： Michael J. Peterson ,  Michael R. Fabry ,  Sean M. Horgan ,  John F. Fletcher ,  William B. Green

IPC: H01R12/71 ,  G11B25/04 ,  H01R12/79 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01R12/716 ,  G11B25/043 ,  H01R12/79 ,  H05K1/113 ,  H05K3/3426 ,  H05K3/3494 ,  H05K2201/10378 ,  Y10T29/49002

Abstract: A method for manufacturing electrical connector assemblies is disclosed. The electrical connector assemblies include an electrical interposer and a first electrical receptacle. The method includes positioning a fixture coupled to or including an array of the first electrical receptacles such that each of the first electrical receptacles aligns with one of the electrical interposers on an assembly with an array of the electrical interposers. The method further includes reflowing solder to mechanically and electrically couple the array of the first electrical receptacles to the array of the electrical interposers.

公开(公告)号：US20220013940A1

公开(公告)日：2022-01-13

申请号：US16925020

申请日：2020-07-09

Applicant: Seagate Technology LLC

Inventor： Michael J. Peterson ,  Michael R. Fabry ,  Sean M. Horgan ,  John F. Fletcher ,  William B. Green

IPC: H01R12/71 ,  G11B25/04 ,  H01R12/79 ,  H05K1/11 ,  H05K3/34

Abstract: A method for manufacturing electrical connector assemblies is disclosed. The electrical connector assemblies include an electrical interposer and a first electrical receptacle. The method includes positioning a fixture coupled to or including an array of the first electrical receptacles such that each of the first electrical receptacles aligns with one of the electrical interposers on an assembly with an array of the electrical interposers. The method further includes reflowing solder to mechanically and electrically couple the array of the first electrical receptacles to the array of the electrical interposers.