公开(公告)号：US10383225B1

公开(公告)日：2019-08-13

申请号：US16100975

申请日：2018-08-10

Applicant: Seagate Technology LLC

Inventor： Michael J. Peterson ,  Michael R. Fabry ,  Sean M. Horgan

IPC: H01L21/48 ,  H01L21/306 ,  H01L21/308 ,  H01L21/768 ,  H01L23/00 ,  H01L23/48 ,  H01L23/367 ,  H01L23/498 ,  H01L23/532 ,  H05K1/11 ,  H05K3/40

Abstract: Aspects of the disclosure are directed to apparatuses and methods involving an electrical connector and methods thereof. As may be consistent with one or more embodiments, an interposer includes respective barrier layers having barrier material that is coplanar with, and laterally surrounds, traces having connected via pads. Vias connect pads of stacked pairs of the traces in different ones of the barrier layers. The traces vary in width along their respective lengths. The barrier material is offset from each trace by a continuous gap having a length extending around the trace, with the gaps extending around each stacked pair being offset from one another along the majority of their respective lengths.

公开(公告)号：US11715895B2

公开(公告)日：2023-08-01

申请号：US16925020

申请日：2020-07-09

Applicant: Seagate Technology LLC

Inventor： Michael J. Peterson ,  Michael R. Fabry ,  Sean M. Horgan ,  John F. Fletcher ,  William B. Green

IPC: H01R12/71 ,  G11B25/04 ,  H01R12/79 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01R12/716 ,  G11B25/043 ,  H01R12/79 ,  H05K1/113 ,  H05K3/3426 ,  H05K3/3494 ,  H05K2201/10378 ,  Y10T29/49002

Abstract: A method for manufacturing electrical connector assemblies is disclosed. The electrical connector assemblies include an electrical interposer and a first electrical receptacle. The method includes positioning a fixture coupled to or including an array of the first electrical receptacles such that each of the first electrical receptacles aligns with one of the electrical interposers on an assembly with an array of the electrical interposers. The method further includes reflowing solder to mechanically and electrically couple the array of the first electrical receptacles to the array of the electrical interposers.

公开(公告)号：US20220013940A1

公开(公告)日：2022-01-13

申请号：US16925020

申请日：2020-07-09

Applicant: Seagate Technology LLC

Inventor： Michael J. Peterson ,  Michael R. Fabry ,  Sean M. Horgan ,  John F. Fletcher ,  William B. Green

IPC: H01R12/71 ,  G11B25/04 ,  H01R12/79 ,  H05K1/11 ,  H05K3/34

Abstract: A method for manufacturing electrical connector assemblies is disclosed. The electrical connector assemblies include an electrical interposer and a first electrical receptacle. The method includes positioning a fixture coupled to or including an array of the first electrical receptacles such that each of the first electrical receptacles aligns with one of the electrical interposers on an assembly with an array of the electrical interposers. The method further includes reflowing solder to mechanically and electrically couple the array of the first electrical receptacles to the array of the electrical interposers.