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    Toothbrush including kit for decorating said toothbrush
    2.
    发明授权
    Toothbrush including kit for decorating said toothbrush 有权
    牙刷包括用于装饰牙刷的套件

    公开(公告)号：US09016471B2

    公开(公告)日：2015-04-28

    申请号：US13992167

    申请日：2011-11-11

    申请人： Eduardo Jimenez ,  David K. Lee ,  Quang Nguyen

    发明人： Eduardo Jimenez ,  David K. Lee ,  Quang Nguyen

    IPC分类号： A46B15/00 ,  A46B17/00 ,  A45D44/18

    CPC分类号： A46B15/0085 ,  A46B15/0087 ,  A46B15/0091 ,  A46B2200/1066

    摘要： A kit for decorating a toothbrush includes the toothbrush having a base portion, and at least one decorative band sized to fit around the outer perimeter of the base portion of the toothbrush. A second embodiment of the kit includes the toothbrush, a writing instrument and an area designated on the base portion for marking with the writing instrument. A third embodiment of the kit includes the toothbrush, a writing instrument, an area designated on the base portion for marking with the writing implement and at least one decorative band sized to fit around the outer perimeter of the base portion of the toothbrush. Any of the kits may include at least one sticker sized to fit on the base portion of the toothbrush. Any of the kits may also include a panel including one or more stickers and/or one or more decorative bands.

    摘要翻译： 用于装饰牙刷的套件包括具有基部的牙刷，以及至少一个装饰带，其尺寸适于围绕牙刷的基部的外周配合。 套件的第二实施例包括牙刷，书写工具和指定在基座部分上用于用书写工具进行标记的区域。 该套件的第三实施例包括牙刷，书写工具，指定在基座部分上用于与书写工具进行标记的区域以及至少一个装饰带，其尺寸适于围绕牙刷基部的外周配合。 任何套件可以包括至少一个大小适合贴在牙刷基部上的贴纸。 任何套件还可以包括包括一个或多个贴纸和/或一个或多个装饰带的面板。

    Systems and methods for controlling quality of service at picocells using agnostic platform
    3.
    发明授权
    Systems and methods for controlling quality of service at picocells using agnostic platform 有权
    使用不可知平台控制微微蜂窝服务质量的系统和方法

    公开(公告)号：US08798678B2

    公开(公告)日：2014-08-05

    申请号：US13224054

    申请日：2011-09-01

    申请人： Quang Nguyen ,  Henry Shi ,  Robert Nino ,  Robert Reagan

    发明人： Quang Nguyen ,  Henry Shi ,  Robert Nino ,  Robert Reagan

    IPC分类号： H04B17/00

    CPC分类号： H04W24/02 ,  H04W88/085

    摘要： Systems and methods for maintaining the quality of service provided by a picocell and for reducing the cost to maintain and operate the picocell. The systems and methods provided herein, in an embodiment, provide for a backhaul and radio agnostic system where the picocell is highly configurable and can be used with a variety of different types of backhauls and radio devices. Remote monitoring and configuration of the device may be provided to reduce the cost of maintaining the picocell.

    摘要翻译： 用于维护微微小区提供的服务质量并降低维护和操作微微小区的成本的系统和方法。 在一个实施例中，本文提供的系统和方法提供了回程和无线电不可知系统，其中微微小区高度可配置并且可以与各种不同类型的回程和无线电设备一起使用。 可以提供设备的远程监视和配置以降低维护微微小区的成本。

    Integrated circuit chip package and method of making the same
    10.
    发明授权
    Integrated circuit chip package and method of making the same 失效
    集成电路芯片封装及其制作方法

    公开(公告)号：US6124546A

    公开(公告)日：2000-09-26

    申请号：US984547

    申请日：1997-12-03

    申请人： James Hayward ,  Quang Nguyen

    发明人： James Hayward ,  Quang Nguyen

    IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/28

    CPC分类号： H01L23/3128 ,  H01L23/49833 ,  H01L2924/0002

    摘要： A semiconductor integrated circuit chip package includes top and bottom interposers 2 and 4, a semiconductor die 14 attached to the top interposer 2, a wirebond 18 or a flipchip connector 52 connected between the die 14 and the top interposer 2, and a tab bond 22 providing an electrical connection from the wirebond 18 or the flipchip connector 52 to outside the bottom interposer 4. A method of making the chip package includes providing top and bottom interposers 2 and 4, attaching a semiconductor die 14 to the top interposer 2, providing a wirebond 18 or a flipchip connector 52 between the die 14 and the top interposer 2, providing a tab bond 22 between the top and bottom interposers 2 and 4, and providing an encapsulant 16 to fill the intermediate volume 40 between the top and bottom interposers 2 and 4.

    摘要翻译： 半导体集成电路芯片封装包括顶部和底部插入件2和4，连接到顶部插入件2的半导体管芯14，连接在管芯14和顶部插入件2之间的引线接合件18或倒装芯片连接器52以及接头接合22 提供从引线键18或倒装芯片连接器52到底部插入件4的外部的电连接。制造芯片封装的方法包括提供顶部和底部插入件2和4，将半导体管芯14附接到顶部插入件2， 引线键18或芯片连接器52在芯片14和顶部插入件2之间提供在顶部和底部插入件2和4之间的接头接合22，并且提供密封剂16以填充顶部和底部插入件2之间的中间体积40 和4。