Measuring elastic moduli of dielectric thin films using an optical metrology system
    1.
    发明授权
    Measuring elastic moduli of dielectric thin films using an optical metrology system 有权
    使用光学测量系统测量介电薄膜的弹性模量

    公开(公告)号:US07019845B1

    公开(公告)日:2006-03-28

    申请号:US10960351

    申请日:2004-10-06

    IPC分类号: G01B9/02 G01B11/28

    CPC分类号: G01N21/211 G01N21/8422

    摘要: An optical metrology system is provided with a data analysis method to determine the elastic moduli of optically transparent dielectric films such as silicon dioxide, other carbon doped oxides over metal or semiconductor substrates. An index of refraction is measured by an ellipsometer and a wavelength of a laser beam is measured using a laser spectrometer. The angle of refraction is determined by directing a light pulse focused onto a wafer surface, measuring a first set of x1, y1, and z1 coordinates, moving the wafer in the z direction, directing the light pulse onto the wafer surface and measuring a second set of x2, y2 and z2 coordinates, using the coordinates to calculate an angle of incidence, calculating an angle of refraction from the calculated angle of incidence, obtaining a sound velocity v, from the calculated angle of refraction and using the determined sound velocity v, to calculate a bulk modulus. Hardware calibration and adjustments for the optical metrology system are also provided in order to minimize the variation of the results from tool to tool down to about 0.5% or below.

    摘要翻译: 光学测量系统具有数据分析方法,以确定光学透明介电膜的弹性模量,例如二氧化硅,金属或半导体衬底上的其他碳掺杂氧化物。 使用椭偏仪测量折射率,使用激光光谱仪测量激光束的波长。 通过将聚焦在晶片表面上的光脉冲引导,测量第一组x 1,y 1和z 1,确定折射角, SUB>坐标,沿z方向移动晶片,将光脉冲引导到晶片表面上并测量第二组x 2,y 2和z 2, 2坐标,使用坐标来计算入射角,从计算的入射角计算折射角,从计算的折射角获得声速v,并使用确定的声速v,到 计算体积模量。 还提供了光学测量系统的硬件校准和调整,以便将结果从工具到工具的降低最小化到约0.5%或更低。