Apparatuses for processing a substrate and methods of processing a substrate

    公开(公告)号:US11833555B2

    公开(公告)日:2023-12-05

    申请号:US17658163

    申请日:2022-04-06

    CPC classification number: B08B7/0021 B08B13/00 H01L21/67011

    Abstract: An apparatus for processing a substrate may include an upper chamber, a lower chamber being combined with the upper chamber and separated from the upper chamber, and at least one driving member for moving the lower chamber in an upward direction and a downward direction. The least one driving member may include a supporting element for supporting the lower chamber, a first driving element for moving the lower chamber and the supporting element, a second driving element for moving the lower chamber, the supporting element and the first driving element, the second driving element being disposed adjacent to the first driving element, and a connecting element for connecting the first driving element to the second driving element. A processing space may be provided between the upper chamber and the lower chamber when the lower chamber is combined with the upper chamber.

    Apparatuses for processing a substrate and methods of processing a substrate

    公开(公告)号:US12059714B2

    公开(公告)日:2024-08-13

    申请号:US18492021

    申请日:2023-10-23

    CPC classification number: B08B7/0021 B08B13/00 H01L21/67011

    Abstract: An apparatus for processing a substrate may include an upper chamber, a lower chamber being combined with the upper chamber and separated from the upper chamber, and at least one driving member for moving the lower chamber in an upward direction and a downward direction. The least one driving member may include a supporting element for supporting the lower chamber, a first driving element for moving the lower chamber and the supporting element, a second driving element for moving the lower chamber, the supporting element and the first driving element, the second driving element being disposed adjacent to the first driving element, and a connecting element for connecting the first driving element to the second driving element. A processing space may be provided between the upper chamber and the lower chamber when the lower chamber is combined with the upper chamber.

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