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公开(公告)号:US11833555B2
公开(公告)日:2023-12-05
申请号:US17658163
申请日:2022-04-06
Applicant: Semes Co., Ltd.
Inventor: Sangmin Lee , Joojib Park , Euisang Lim
CPC classification number: B08B7/0021 , B08B13/00 , H01L21/67011
Abstract: An apparatus for processing a substrate may include an upper chamber, a lower chamber being combined with the upper chamber and separated from the upper chamber, and at least one driving member for moving the lower chamber in an upward direction and a downward direction. The least one driving member may include a supporting element for supporting the lower chamber, a first driving element for moving the lower chamber and the supporting element, a second driving element for moving the lower chamber, the supporting element and the first driving element, the second driving element being disposed adjacent to the first driving element, and a connecting element for connecting the first driving element to the second driving element. A processing space may be provided between the upper chamber and the lower chamber when the lower chamber is combined with the upper chamber.
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公开(公告)号:US12059714B2
公开(公告)日:2024-08-13
申请号:US18492021
申请日:2023-10-23
Applicant: Semes Co., Ltd.
Inventor: Sangmin Lee , Joojib Park , Euisang Lim
CPC classification number: B08B7/0021 , B08B13/00 , H01L21/67011
Abstract: An apparatus for processing a substrate may include an upper chamber, a lower chamber being combined with the upper chamber and separated from the upper chamber, and at least one driving member for moving the lower chamber in an upward direction and a downward direction. The least one driving member may include a supporting element for supporting the lower chamber, a first driving element for moving the lower chamber and the supporting element, a second driving element for moving the lower chamber, the supporting element and the first driving element, the second driving element being disposed adjacent to the first driving element, and a connecting element for connecting the first driving element to the second driving element. A processing space may be provided between the upper chamber and the lower chamber when the lower chamber is combined with the upper chamber.
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