公开(公告)号：US20240207903A1

公开(公告)日：2024-06-27

申请号：US18393884

申请日：2023-12-22

Applicant: SEMES CO., LTD.

Inventor： Jongdoo Lee ,  Taejong Choi ,  Juyeon Song ,  Sangmin Lee

IPC: B08B3/04 ,  H01L21/67

CPC classification number: B08B3/04 ,  H01L21/67017

Abstract: Provided is a substrate processing apparatus including a body having a substrate treatment space therein, a fluid supply unit configured to supply a treatment fluid to the substrate treatment space, a fluid exhaust line to exhaust the treatment fluid from the substrate treatment space, a clamp body configured to surround and fix the body, a friction prevention member arranged between the body and the clamp body and configured to prevent friction between the body and the clamp body, a conductor extending along at least a portion of an outer rim of the friction prevention member, and a processor configured to detect whether the conductor has been deformed, based on an output signal that is output in response to an electrical signal applied to the conductor.

公开(公告)号：US12059714B2

公开(公告)日：2024-08-13

申请号：US18492021

申请日：2023-10-23

Applicant: Semes Co., Ltd.

Inventor： Sangmin Lee ,  Joojib Park ,  Euisang Lim

IPC: B08B3/02 ,  B08B7/00 ,  B08B13/00 ,  H01L21/67

CPC classification number: B08B7/0021 ,  B08B13/00 ,  H01L21/67011

Abstract: An apparatus for processing a substrate may include an upper chamber, a lower chamber being combined with the upper chamber and separated from the upper chamber, and at least one driving member for moving the lower chamber in an upward direction and a downward direction. The least one driving member may include a supporting element for supporting the lower chamber, a first driving element for moving the lower chamber and the supporting element, a second driving element for moving the lower chamber, the supporting element and the first driving element, the second driving element being disposed adjacent to the first driving element, and a connecting element for connecting the first driving element to the second driving element. A processing space may be provided between the upper chamber and the lower chamber when the lower chamber is combined with the upper chamber.

公开(公告)号：US11833555B2

公开(公告)日：2023-12-05

申请号：US17658163

申请日：2022-04-06

Applicant: Semes Co., Ltd.

Inventor： Sangmin Lee ,  Joojib Park ,  Euisang Lim

IPC: B08B7/00 ,  B08B13/00 ,  H01L21/67

CPC classification number: B08B7/0021 ,  B08B13/00 ,  H01L21/67011

Abstract: An apparatus for processing a substrate may include an upper chamber, a lower chamber being combined with the upper chamber and separated from the upper chamber, and at least one driving member for moving the lower chamber in an upward direction and a downward direction. The least one driving member may include a supporting element for supporting the lower chamber, a first driving element for moving the lower chamber and the supporting element, a second driving element for moving the lower chamber, the supporting element and the first driving element, the second driving element being disposed adjacent to the first driving element, and a connecting element for connecting the first driving element to the second driving element. A processing space may be provided between the upper chamber and the lower chamber when the lower chamber is combined with the upper chamber.

公开(公告)号：US11367635B2

公开(公告)日：2022-06-21

申请号：US16133043

申请日：2018-09-17

Applicant: SEMES CO., LTD.

Inventor： Sangmin Lee ,  Woo Young Kim ,  Joo Jib Park ,  Boong Kim

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673 ,  H01L21/02

Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.

公开(公告)号：US20190096717A1

公开(公告)日：2019-03-28

申请号：US16133043

申请日：2018-09-17

Applicant: SEMES CO., LTD.

Inventor： Sangmin Lee ,  Woo Young Kim ,  Joo Jib Park ,  Boong Kim

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673 ,  H01L21/02

Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.