公开(公告)号：US20220208561A1

公开(公告)日：2022-06-30

申请号：US17377666

申请日：2021-07-16

Applicant: Semes Co., Ltd.

Inventor： Yonghee LEE ,  Sangmin LEE ,  Euisang LIM ,  Dohyeon YOON

IPC: H01L21/67

Abstract: An apparatus for processing a substrate may include a process chamber providing a processing space in which a predetermined process may be performed on the substrate, and a supporting device contacting the process chamber and supporting the process chamber. The supporting device may include a supporting chamber providing a supporting space for supporting components of the process chamber and a supply member supplying a fluid into the supporting space.

公开(公告)号：US20240042497A1

公开(公告)日：2024-02-08

申请号：US18492021

申请日：2023-10-23

Applicant: Semes Co., Ltd.

Inventor： Sangmin LEE ,  Joojib PARK ,  Euisang LIM

IPC: B08B7/00 ,  B08B13/00 ,  H01L21/67

CPC classification number: B08B7/0021 ,  B08B13/00 ,  H01L21/67011

Abstract: An apparatus for processing a substrate may include an upper chamber, a lower chamber being combined with the upper chamber and separated from the upper chamber, and at least one driving member for moving the lower chamber in an upward direction and a downward direction. The least one driving member may include a supporting element for supporting the lower chamber, a first driving element for moving the lower chamber and the supporting element, a second driving element for moving the lower chamber, the supporting element and the first driving element, the second driving element being disposed adjacent to the first driving element, and a connecting element for connecting the first driving element to the second driving element. A processing space may be provided between the upper chamber and the lower chamber when the lower chamber is combined with the upper chamber.

公开(公告)号：US20220362817A1

公开(公告)日：2022-11-17

申请号：US17658163

申请日：2022-04-06

Applicant: Semes Co., Ltd.

Inventor： Sangmin LEE ,  Joojib PARK ,  Euisang LIM

IPC: B08B7/00 ,  B08B13/00

Abstract: An apparatus for processing a substrate may include an upper chamber, a lower chamber being combined with the upper chamber and separated from the upper chamber, and at least one driving member for moving the lower chamber in an upward direction and a downward direction. The least one driving member may include a supporting element for supporting the lower chamber, a first driving element for moving the lower chamber and the supporting element, a second driving element for moving the lower chamber, the supporting element and the first driving element, the second driving element being disposed adjacent to the first driving element, and a connecting element for connecting the first driving element to the second driving element. A processing space may be provided between the upper chamber and the lower chamber when the lower chamber is combined with the upper chamber.

公开(公告)号：US20220246452A1

公开(公告)日：2022-08-04

申请号：US17726721

申请日：2022-04-22

Applicant: Semes Co., Ltd

Inventor： Sangmin LEE ,  Woo Young KIM ,  Joo Jib PARK ,  Boong KIM

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673 ,  H01L21/02

Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.