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1.发明授权公开(公告)号：US11417799B2
公开(公告)日：2022-08-16
申请号：US16987478
申请日：2020-08-07
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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2.发明公开公开(公告)号：US20240072203A1
公开(公告)日：2024-02-29
申请号：US18387129
申请日：2023-11-06
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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3.发明授权公开(公告)号：US11862755B2
公开(公告)日：2024-01-02
申请号：US17868949
申请日：2022-07-20
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US11862754B2
公开(公告)日：2024-01-02
申请号：US17740729
申请日：2022-05-10
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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5.发明申请公开(公告)号：US20220359785A1
公开(公告)日：2022-11-10
申请号：US17868949
申请日：2022-07-20
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US11370869B2
公开(公告)日：2022-06-28
申请号：US17265025
申请日：2019-07-11
IPC分类号： C08F290/14 , B33Y70/00 , B29C64/112 , C08F2/50
摘要： According to the present invention, an ultraviolet curable silicone composition for stereolithography, which contains
(A) an organopolysiloxane that has two groups represented by formula (1) (wherein each R1 independently represents a monovalent hydrocarbon group having 1-20 carbon atoms; R2 represents an oxygen atom or the like; R3 represents an acryloyloxyalkyl group or the like; p represents a number satisfying 0≤p≤10; and a represents a number satisfying 1≤a≤3) in each molecule, (B) an organopolysiloxane resin that is composed of (a) a unit represented by formula (2) (wherein R1-R3, a and p are as defined above), (b) an R43SiO1/2 unit (wherein each R4 independently represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (c) an SiO4/2 unit, and wherein the molar ratio of the total of the unit (a) and the unit (b) to the unit (c) is within the range of 0.6-1.2:1 and (C) a photopolymerization initiator has a viscosity that is applicable to a stereolithography system such as lifting system and forms a cured product which has excellent physical properties of rubber.-
公开(公告)号：US11180680B2
公开(公告)日：2021-11-23
申请号：US16646743
申请日：2018-09-19
发明人： Kohei Otake , Nobuaki Matsumoto , Eri Asakura
摘要： This composition contains (A) 100 parts of an organopolysiloxane having two groups represented by general formula (1) (R1 represents a monovalent hydrocarbon group having 1-20 carbon atoms, R2 represents an oxygen atom or the like, R3 represents an acryloyloxyalkyl group or the like, p represents a number satisfying 0≤p≤10, and “a” represents a number satisfying 1≤a≤3) per molecule, (B) 1-500 parts of a monofunctional (meth)acrylate compound not containing a siloxane structure, (C) 1-5,000 parts of an organopolysiloxane resin containing (a) an R43SiO1/2 unit (in the formula, R4 represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (b) a SiO4/2 unit, where the molar ratio of the unit (a) to the unit (b) is in the range of 0.6 to 1.2:1, (D) 1-100 parts of fine powder silica, and (E) 0.01-20 parts of an optical polymerization initiator. The compound has good shape retention properties and curability for irradiation with ultraviolet light, and provides a cured product which has excellent adhesion suitable for a temporary fixing material.
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公开(公告)号：US11124680B2
公开(公告)日：2021-09-21
申请号：US16619850
申请日：2018-05-07
摘要： An ultraviolet-curable pressure-sensitive silicone adhesive composition which comprises: 100 parts of an organopolysiloxane (A) having, in the molecule, two groups represented by general formula (1) (wherein R1 represents a C1-20 monovalent hydrocarbon group, R2 represents an oxygen atom, etc., R3 represents an acryloyloxyalkyl group, etc., p and a respectively indicate numbers satisfying 0≤p≤10 and 1≤a≤3); 1-500 parts of a monofunctional (meth)acrylate compound (B) containing no siloxane structure and/or a polyfunctional (meth)acrylate compound (C) containing no siloxane structure; 1-5,000 parts of an oranopolysiloxane resin (D) comprising R43SiO1/2 units (a) (wherein R4 represents a C1-10 monovalent hydrocarbon group) and SiO4/2 units (b), the (a)/(b) molar ratio being (0.6-1.2)/1; and 0.01-20 parts of a photopolymerization initiator (E). This composition has satisfactory applicability and curability and gives a cured object which, when used as a temporary fixer, has excellent tackiness and strength.
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公开(公告)号：US11028269B2
公开(公告)日：2021-06-08
申请号：US15971019
申请日：2018-05-04
发明人： Norifumi Kawamura , Shoichi Osada , Kohei Otake
IPC分类号： C08L83/06 , H01L33/56 , H01L23/29 , C08L83/10 , C08K5/00 , C08G59/14 , C08G59/40 , C08G59/32 , C08G59/62 , C08G59/30 , C08G77/42 , C08G77/00 , C08G77/14 , C08G77/38 , C08G77/388
摘要： The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.
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