-
公开(公告)号:US20190326444A1
公开(公告)日:2019-10-24
申请号:US16459951
申请日:2019-07-02
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Kengo AKIMOTO , Tatsuya HONDA , Norihito SONE
IPC: H01L29/786 , H01L21/02 , H01L29/04 , H01L27/12 , H01L21/465 , H01L21/428 , H01L21/477 , H01L29/66
Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.
-
公开(公告)号:US20150340513A1
公开(公告)日:2015-11-26
申请号:US14816686
申请日:2015-08-03
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Kengo AKIMOTO , Tatsuya HONDA , Norihito SONE
IPC: H01L29/786 , H01L21/428 , H01L21/465 , H01L21/477 , H01L27/12 , H01L21/02
CPC classification number: H01L29/78696 , H01L21/02164 , H01L21/0217 , H01L21/02178 , H01L21/02266 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L21/02667 , H01L21/428 , H01L21/465 , H01L21/477 , H01L27/1225 , H01L27/1285 , H01L29/04 , H01L29/045 , H01L29/66969 , H01L29/7869 , H01L29/78693
Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.
-
公开(公告)号:US20220069137A1
公开(公告)日:2022-03-03
申请号:US17521021
申请日:2021-11-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Kengo AKIMOTO , Tatsuya HONDA , Norihito SONE
IPC: H01L29/786 , H01L27/12 , H01L21/02 , H01L21/465 , H01L21/477 , H01L21/428 , H01L29/04 , H01L29/66
Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.
-
公开(公告)号:US20190051759A1
公开(公告)日:2019-02-14
申请号:US16162505
申请日:2018-10-17
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Kengo AKIMOTO , Tatsuya HONDA , Norihito SONE
IPC: H01L29/786 , H01L21/02 , H01L29/66 , H01L29/04 , H01L27/12 , H01L21/477 , H01L21/465 , H01L21/428
Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.
-
-
-