公开(公告)号：US20030188447A1

公开(公告)日：2003-10-09

申请号：US10397946

申请日：2003-03-25

Applicant: Semitool, Inc.

Inventor： Gordon R. Nelson ,  Jeffry A. Davis ,  Raymon F. Thompson ,  Eric J. Bergman

IPC: F26B017/24

CPC classification number: H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S269/903

Abstract: A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.