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    System for processing a workpiece
    2.
    发明申请
    System for processing a workpiece 失效
    用于加工工件的系统

    公开(公告)号：US20010047757A1

    公开(公告)日：2001-12-06

    申请号：US09922362

    申请日：2001-08-02

    Applicant: SEMITOOL, INC.

    Inventor： Gary L. Curtis ,  Raymon F. Thompson

    IPC: C23C016/00

    CPC classification number: H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

    Abstract: An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing defines a substantially closed processing chamber therein in which one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. A dividing member at the edge of the spinning workpiece separates flow of fluids off of the top and bottom surfaces of the workpiece.

    Abstract translation: 用于在微环境中处理工件的装置包括连接到用于旋转的电动机的工件壳体。 工件壳体在其中限定基本封闭的处理室，其中一个或多个处理流体在壳体旋转期间产生的离心力穿过工件的至少一个面分布。 旋转工件边缘处的分隔构件将流体流离开工件的顶面和底面。

    Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
    5.
    发明申请
    Micro-environment chamber and system for rinsing and drying a semiconductor workpiece 有权
    用于冲洗和干燥半导体工件的微环境室和系统

    公开(公告)号：US20010032660A1

    公开(公告)日：2001-10-25

    申请号：US09881246

    申请日：2001-06-12

    Applicant: SEMITOOL, INC.

    Inventor： Gary L. Curtis ,  Raymon F. Thompson

    IPC: B08B003/02

    CPC classification number: H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67075 ,  H01L21/6708 ,  Y10S134/902

    Abstract: In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

    Abstract translation: 在微环境中冲洗和干燥半导体工件的方法中，将工件放置在冲洗机/干燥器壳体中。 洗衣机/烘干机壳体由转子电动机旋转。 洗衣机/干燥器壳体限定了基本封闭的冲洗机/干燥器室。 冲洗和干燥流体通过壳体旋转期间产生的离心力的作用分布在半导体工件的至少一个表面上。 液体供应系统被连接以在壳体旋转时依次供应冲洗流体，然后将干燥流体提供给腔室。

    Reactor for processing a semiconductor wafer
    6.
    发明申请
    Reactor for processing a semiconductor wafer 失效
    用于处理半导体晶片的反应器

    公开(公告)号：US20020189652A1

    公开(公告)日：2002-12-19

    申请号：US10223974

    申请日：2002-08-20

    Applicant: Semitool, Inc.

    Inventor： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

    IPC: B08B003/00

    CPC classification number: H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

    Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

    Abstract translation: 用于处理半导体晶片或类似物品的方法包括在旋转晶片时旋转晶片并将其施加到晶片的第一侧的步骤。 流体通过离心力在晶片的第一侧上在所有方向上径向向外流动。 当流体从晶片的圆周边缘流出时，其被包含在环形储存器中，使得流体也流到晶片的第二侧的外部环形区域。 开口允许流体从储存器流出。 开口限定分流线的位置，超过该分隔线，流体不会在晶片的第二侧上行进。 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，可以通过机器人将其从反应器中移除。

    Reactor for processing a semiconductor wafer
    7.
    发明申请
    Reactor for processing a semiconductor wafer 有权
    用于处理半导体晶片的反应器

    公开(公告)号：US20020185163A1

    公开(公告)日：2002-12-12

    申请号：US10202074

    申请日：2002-07-23

    Applicant: Semitool, Inc.

    Inventor： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

    IPC: B08B003/00

    CPC classification number: H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

    Abstract: An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

    Abstract translation: 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

    System for processing a workpiece
    8.
    发明申请
    System for processing a workpiece 失效
    用于加工工件的系统

    公开(公告)号：US20020023717A1

    公开(公告)日：2002-02-28

    申请号：US09921845

    申请日：2001-08-02

    Applicant: SEMITOOL, INC.

    Inventor： Gary L. Curtis ,  Raymon F. Thompson

    IPC: C23F001/02

    CPC classification number: H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

    Abstract: An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a substantially closed processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. Multiple housings may be vertically stacked and rotated about a common rotation axis to simultaneously process multiple workpieces in a small space.

    Abstract translation: 用于在微环境中处理工件的装置包括连接到用于旋转的电动机的工件壳体。 工件壳体形成基本封闭的处理室，其中一个或多个处理流体通过在壳体旋转期间产生的离心力分布在工件的至少一个面上。 多个壳体可以垂直堆叠并围绕公共旋转轴线旋转，以在小空间中同时处理多个工件。

    Dual cassette centrifugal processor
    9.
    发明申请
    Dual cassette centrifugal processor 失效
    双盒离心处理器

    公开(公告)号：US20020179122A1

    公开(公告)日：2002-12-05

    申请号：US10164164

    申请日：2002-06-05

    Applicant: Semitool, Inc.

    Inventor： Raymon F. Thompson ,  Clif Neil

    IPC: B08B003/02

    CPC classification number: H01L21/67313 ,  B08B3/02 ,  Y10S134/901 ,  Y10S134/902 ,  Y10S414/14

    Abstract: In a method for processing flat media, such as semiconductor wafers, first and second cassettes carrying wafers are loaded into a dual position rotor. The cassettes are restrained within the rotor by support tubes and hold down pins. Processing capacity is increased, as two cassettes are simultaneously processed.

    Abstract translation: 在用于处理诸如半导体晶片的扁平介质的方法中，将携带晶片的第一和第二盒装载到双位置转子中。 通过支撑管和压紧销将盒子限制在转子内。 随着两个盒被同时处理，处理能力增加。

    Selective treatment of the surface of a microelectronic workpiece
    10.
    发明申请
    Selective treatment of the surface of a microelectronic workpiece 审中-公开
    选择性处理微电子工件的表面

    公开(公告)号：US20020144973A1

    公开(公告)日：2002-10-10

    申请号：US10150631

    申请日：2002-05-17

    Applicant: Semitool, Inc.

    Inventor： Brian Aegerter ,  Curt T. Dundas ,  Michael Jolley ,  Tom L. Ritzdorf ,  Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson

    IPC: H01B013/00

    CPC classification number: H01L21/67017 ,  C23F1/18 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S438/928 ,  Y10S438/963

    Abstract: In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

    Abstract translation: 在处理诸如半导体晶片的工件的处理中，处理流体被选择性地从工件的前侧或后侧中的至少一个的外周边缘施加或排除。 通过在工件和保持工件的反应器旋转的同时将一种或多种加工流体施加到工件来发生加工流体的排除和/或应用。 处理流体的流量，流体压力和/或旋转速率用于控制从外周边缘选择性地施加或排除处理流体的程度。

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