Systems and methods for processing workpieces
    1.
    发明申请
    Systems and methods for processing workpieces 失效
    用于加工工件的系统和方法

    公开(公告)号:US20030010362A1

    公开(公告)日:2003-01-16

    申请号:US09907544

    申请日:2001-07-16

    Applicant: Semitool, Inc.

    CPC classification number: H01L21/67057 B08B3/045 Y10S134/902

    Abstract: Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

    Abstract translation: 需要低水平污染的工件(例如半导体晶片)被装载到处理室内的转子中。 处理室在其圆柱形壁上具有水平排放开口。 房间通过门关闭。 将过程或冲洗液体引入室中。 液体升高到一定水平,使得工件浸入液体中。 腔室缓慢地枢转或旋转以将排水口向下移动到液体的高度。 液体通过排水口排出。 排水口保持在液体表面附近,以均匀的速度排出液体。 在液体上方引入有机溶剂蒸汽,以帮助防止液体液滴排出时残留在工件上。 转子旋转工件以帮助通过离心力去除任何剩余的液滴。

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