Process and apparatus for treating a workpiece such as a semiconductor wafer
    1.
    发明申请
    Process and apparatus for treating a workpiece such as a semiconductor wafer 审中-公开
    用于处理诸如半导体晶片的工件的工艺和设备

    公开(公告)号:US20020157686A1

    公开(公告)日:2002-10-31

    申请号:US09925884

    申请日:2001-08-06

    Applicant: Semitool, Inc.

    Abstract: In a system for cleaning a workpiece or wafer, a boundary layer of heated liquid is formed on the workpiece surface. Ozone is provided around the workpiece. The ozone diffuses through the boundary layer and chemically reacts with contaminants on the workpiece surface. A jet of high velocity heated liquid is directed against the workpiece, to physically dislodge or remove a contaminant from the workpiece. The jet penetrates through the boundary layer at the point of impact. The boundary layer otherwise remains largely undisturbed. Preferably, the liquid includes water, and may also include a chemical. Steam may also be jetted onto the workpiece, with the steam also physically removing contaminants, and also heating the workpiece to speed up chemical cleaning. The workpiece and the jet of liquid are moved relative to each other, so that substantially all areas of the workpiece surface facing the jet are exposed at least momentarily to the jet. Sonic or electromagnetic energy may also be introduced to the workpiece.

    Abstract translation: 在用于清洁工件或晶片的系统中,在工件表面上形成加热液体的边界层。 在工件周围提供臭氧。 臭氧通过边界层扩散并与工件表面上的污染物发生化学反应。 高速加热液体的喷嘴被引导到工件上,以物理地移除或去除工件上的污染物。 喷射器在冲击点穿过边界层。 否则边界层大体上不受干扰。 优选地,液体包括水,并且还可以包括化学品。 蒸汽也可以喷射到工件上,蒸汽还物理地去除污染物,并且还加热工件以加速化学清洁。 工件和液体射流相对于彼此移动,使得面对射流的工件表面的基本上所有区域至少暴露于射流。 也可以将声波或电磁能引入到工件中。

    Multi-process system
    2.
    发明申请
    Multi-process system 失效
    多进程系统

    公开(公告)号:US20040040573A1

    公开(公告)日:2004-03-04

    申请号:US10655210

    申请日:2003-09-04

    Applicant: Semitool, Inc.

    CPC classification number: B08B3/12 Y10S134/902

    Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

    Abstract translation: 用于处理工件的系统包括可枢转地支撑在外室内的内室。 内室具有开口以允许液体排出。 电动机使内腔枢转,使开口处于内腔液面之下或之下。 当内室转动时,液体排出。 内腔内的工件支撑在可固定或旋转的支架或转子上。 多个工艺可以在内腔内执行,减少了在各种装置之间移动工件的需要,并降低了污染的风险。

    Processing a workpiece using ozone and sonic energy
    3.
    发明申请
    Processing a workpiece using ozone and sonic energy 审中-公开
    使用臭氧和声波处理工件

    公开(公告)号:US20020066464A1

    公开(公告)日:2002-06-06

    申请号:US10051860

    申请日:2002-01-16

    Applicant: Semitool, Inc.

    Inventor: Eric Bergman

    Abstract: An apparatus for processing a semi-conductor wafer or similar workpiece has one or more liquid outlets for applying a heated process liquid to the wafer within a process chamber. Ozone gas is provided into the chamber directly, or via the processed liquid. Sonic energy is introduced to the workpiece through a layer of liquid. In an alternative design, the wafers are immersed in heated process liquid, and an ozone atmosphere is provided above the liquid. The wafers are then lifted out of the liquid, or the liquid is alternatively drained off. The ozone gas/liquid interface passes down across the surfaces of the wafers.

    Abstract translation: 用于处理半导体晶片或类似工件的设备具有一个或多个液体出口,用于将加热的处理液体施加到处理室内的晶片。 臭氧气体直接或通过处理液体被提供到室内。 声能通过一层液体引入工件。 在替代设计中,将晶片浸入加热的工艺液体中,并且在液体上方设置臭氧气氛。 然后将晶片从液体中提出,或者液体被排出。 臭氧气体/液体界面穿过晶片的表面。

    Systems and methods for processing workpieces
    4.
    发明申请
    Systems and methods for processing workpieces 失效
    用于加工工件的系统和方法

    公开(公告)号:US20030010362A1

    公开(公告)日:2003-01-16

    申请号:US09907544

    申请日:2001-07-16

    Applicant: Semitool, Inc.

    CPC classification number: H01L21/67057 B08B3/045 Y10S134/902

    Abstract: Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

    Abstract translation: 需要低水平污染的工件(例如半导体晶片)被装载到处理室内的转子中。 处理室在其圆柱形壁上具有水平排放开口。 房间通过门关闭。 将过程或冲洗液体引入室中。 液体升高到一定水平,使得工件浸入液体中。 腔室缓慢地枢转或旋转以将排水口向下移动到液体的高度。 液体通过排水口排出。 排水口保持在液体表面附近,以均匀的速度排出液体。 在液体上方引入有机溶剂蒸汽,以帮助防止液体液滴排出时残留在工件上。 转子旋转工件以帮助通过离心力去除任何剩余的液滴。

    Multi-process system
    5.
    发明申请
    Multi-process system 失效
    多进程系统

    公开(公告)号:US20030010352A1

    公开(公告)日:2003-01-16

    申请号:US09907485

    申请日:2001-07-16

    Applicant: Semitool, Inc.

    CPC classification number: B08B3/12 Y10S134/902

    Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

    Abstract translation: 用于处理工件的系统包括可枢转地支撑在外室内的内室。 内室具有开口以允许液体排出。 电动机使内腔枢转,使开口处于内腔液面之下或之下。 当内室转动时,液体排出。 内腔内的工件支撑在可固定或旋转的支架或转子上。 多个工艺可以在内腔内执行,减少了在各种装置之间移动工件的需要,并减少污染的风险。

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