公开(公告)号：US20030056814A1

公开(公告)日：2003-03-27

申请号：US10200043

申请日：2002-07-19

Applicant: Semitool, Inc.

Inventor： Jon Kuntz ,  Steven Peace ,  Ed Derks ,  Brian Aegerter

IPC: B08B003/00 ,  B08B001/02 ,  B65G049/07 ,  B08B007/00

CPC classification number: H01L21/68785 ,  H01L21/67057 ,  H01L21/67086 ,  H01L21/6715 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/14 ,  Y10S438/906 ,  Y10S438/913

Abstract: A process system for processing a semiconductor wafer or other similar flat workpiece has a head including a workpiece holder. A motor in the head spins the workpiece. A head lifter lowers the head to move the workpiece into a bath of liquid in a bowl. Sonic energy is introduced into the liquid and travels through the liquid to the workpiece, to assist in processing. The head is lifted to bring the workpiece to a rinse position. The bath liquid is drained. The workpiece is rinsed via radial spray nozzles in the base. The head is lifted to a dry position. A reciprocating swing arm sprays a drying fluid onto the bottom surface of the spinning wafer, to dry the wafer.

Abstract translation: 用于处理半导体晶片或其它类似的平坦工件的处理系统具有包括工件保持器的头部。 头部的电机旋转工件。 头部升降器降低头部以将工件移动到碗中的液体浴中。 声能被引入到液体中并通过液体传送到工件，以帮助加工。 抬起头部以使工件进入冲洗位置。 浴液被排出。 工件通过基座中的径向喷嘴冲洗。 头部被抬起到干燥的位置。 往复摇摆臂将干燥流体喷射到旋转晶片的底表面上，以干燥晶片。