公开(公告)号：US11123824B2

公开(公告)日：2021-09-21

申请号：US16605744

申请日：2018-12-26

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Takahiro Yokoyama ,  Shunsaku Yoshikawa

IPC: B23K35/26 ,  B23K103/08

Abstract: A solder alloy has an alloy composition including, in mass %, 0.8% to 10% of Cu and Sn. The solder alloy includes an intermetallic compound. The intermetallic compound has a maximum grain size of 100 μm or less in a region at least 50 μm away from a surface of the solder alloy.

公开(公告)号：US20240238914A1

公开(公告)日：2024-07-18

申请号：US18410462

申请日：2024-01-11

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takahiro Yokoyama ,  Shunsaku Yoshikawa ,  Yuki Iijima ,  Kanta Dei ,  Takahiro Matsufuji ,  Kota Sugisawa ,  Shigeto Suzuki

IPC: B23K35/26 ,  B23K35/02 ,  C22C13/02 ,  B23K101/42

CPC classification number: B23K35/262 ,  B23K35/025 ,  C22C13/02 ,  B23K2101/42

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

公开(公告)号：US20240238913A1

公开(公告)日：2024-07-18

申请号：US18410205

申请日：2024-01-11

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takahiro Yokoyama ,  Shunsaku Yoshikawa ,  Yuki Iijima ,  Kanta Dei ,  Takahiro Matsufuji ,  Kota Sugisawa ,  Shigeto Suzuki

IPC: B23K35/26 ,  B23K1/00 ,  B23K35/02 ,  B23K101/42 ,  C22C13/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/025 ,  C22C13/02 ,  B23K2101/42

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: more than 0.008% and 0.020% or less, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

公开(公告)号：US11992902B2

公开(公告)日：2024-05-28

申请号：US17896321

申请日：2022-08-26

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takahiro Yokoyama ,  Shunsaku Yoshikawa

IPC: B23K35/26 ,  B23K35/02 ,  B23K101/42 ,  C22C1/02 ,  C22C1/03 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K35/0222 ,  C22C1/02 ,  C22C1/03 ,  C22C13/00 ,  B23K2101/42

Abstract: Provided are a solder alloy and a solder joint, which have a narrow ΔT to suppress solder bridges and solder icicles, and a small amount of dross generated in a solder tank, suppress Cu leaching, and have higher strength. The solder alloy has an alloy composition of, by mass %, Cu: more than 2.0% and less than 3.0%; Ni: 0.010% or more and less than 0.30%; and Ge: 0.0010 to 0.20% with the balance being Sn. Preferably, by mass %, Cu is more than 2.5% and less than 3.0%, and the alloy composition satisfies the following relations (1) and (2): 2.400≤Cu+Ni+Ge≤3.190 (1), and 0.33≤Ge/Ni≤1.04 (2). Cu, Ni, and Ge in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

公开(公告)号：US11241760B2

公开(公告)日：2022-02-08

申请号：US16642288

申请日：2019-02-22

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Takahiro Yokoyama ,  Takahiro Matsufuji ,  Hikaru Nomura ,  Shunsaku Yoshikawa

IPC: B23K35/26 ,  B23K35/02 ,  B23K103/08

Abstract: The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure, improves the ductility and the shear strength, and has excellent heat-cycle resistance. The solder alloy comprises an alloy composition composed of 35 to 68 mass % of Bi, 0.1 to 2.0 mass % of Sb, 0.01 to 0.10 mass % of Ni, and a balance of Sn. The alloy composition may contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass % or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.

公开(公告)号：US20240238912A1

公开(公告)日：2024-07-18

申请号：US18409939

申请日：2024-01-11

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takahiro Yokoyama ,  Shunsaku Yoshikawa ,  Yuki Iijima ,  Kanta Dei ,  Takahiro Matsufuji ,  Kota Sugisawa ,  Shigeto Suzuki

IPC: B23K35/26 ,  B23K35/02 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00

Abstract: A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: 1.1% or more and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.

公开(公告)号：US20230084073A1

公开(公告)日：2023-03-16

申请号：US17896321

申请日：2022-08-26

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takahiro Yokoyama ,  Shunsaku Yoshikawa

IPC: B23K35/26 ,  C22C13/00

Abstract: Provided are a solder alloy and a solder joint, which have a narrow ΔT to suppress solder bridges and solder icicles, and a small amount of dross generated in a solder tank, suppress Cu leaching, and have higher strength. The solder alloy has an alloy composition of, by mass %, Cu: more than 2.0% and less than 3.0%; Ni: 0.010% or more and less than 0.30%; and Ge: 0.0010 to 0.20% with the balance being Sn. Preferably, by mass %, Cu is more than 2.5% and less than 3.0%, and the alloy composition satisfies the following relations (1) and (2): ≤2.400≤Cu+Ni+Ge≤3.190 (1), and 0.33≤Ge/Ni≤1.04 (2). Cu, Ni, and Ge in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

公开(公告)号：US20250058414A1

公开(公告)日：2025-02-20

申请号：US18697138

申请日：2022-09-29

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takahiro Yokoyama ,  Takashi Saito ,  Shunsaku Yoshikawa ,  Kota Sugisawa

IPC: B23K35/26 ,  B23K35/02 ,  C22C13/00

Abstract: Provided are a solder alloy and a solder joint formed from the soldier alloy. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.7%, Cu: 0.4 to 0.8%, Sb: 0.50 to 2.90%, In: 5.00 to 10.00%, and Ni: 0.01 to 0.06%, with the balance being Sn.

公开(公告)号：US20240399512A1

公开(公告)日：2024-12-05

申请号：US18697164

申请日：2022-09-29

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takahiro Yokoyama ,  Yuki Iijima ,  Takashi Saito ,  Shunsaku Yoshikawa ,  Kanta Dei ,  Kota Sugisawa

IPC: B23K35/26 ,  B23K35/02 ,  B23K101/42 ,  C22C13/02

Abstract: Provided are a solder alloy, a solder ball, a solder preform, a solder paste, and a solder joint which have excellent wettability and high reliability by prevention of rupture of solder joints. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.8%, Cu: 0.4 to 0.8%, Sb: 0.03 to 2.90%, In: 1.1 to 4.2%, Ni: 0.01 to 0.14%, Bi: 0.1 to 5.0%, with the balance being Sn.