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公开(公告)号：US08721117B2
公开(公告)日：2014-05-13
申请号：US12675589
申请日：2008-08-20
申请人： Seok Hoon Kang , Jun Seok Park
发明人： Seok Hoon Kang , Jun Seok Park
CPC分类号： F21S2/005 , F21V23/06 , F21Y2115/10 , G02F1/133603 , G02F2001/133612 , H01R12/716 , H01R12/724 , H01R12/732 , H05K1/142 , H05K3/308 , H05K3/3447 , H05K2201/10106 , H05K2201/10189 , H05K2201/1059
摘要： A lighting device comprises: a first substrate comprising a first connector and a first connection terminal, the first connector being connected to an external power supply or driving device, the first connection terminal being electrically connected to the first connector; and a second substrate connected electrically to the first connection terminal and comprising a light emitting device.
摘要翻译： 照明装置包括：第一基板，包括第一连接器和第一连接端子，所述第一连接器连接到外部电源或驱动装置，所述第一连接端子电连接到所述第一连接器; 以及第二基板，电连接到第一连接端子并且包括发光器件。
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公开(公告)号：US20100238674A1
公开(公告)日：2010-09-23
申请号：US12675589
申请日：2008-08-20
申请人： Seok Hoon Kang , Jun Seok Park
发明人： Seok Hoon Kang , Jun Seok Park
IPC分类号： F21V21/00
CPC分类号： F21S2/005 , F21V23/06 , F21Y2115/10 , G02F1/133603 , G02F2001/133612 , H01R12/716 , H01R12/724 , H01R12/732 , H05K1/142 , H05K3/308 , H05K3/3447 , H05K2201/10106 , H05K2201/10189 , H05K2201/1059
摘要： A lighting device comprises: a first substrate comprising a first connector and a first connection terminal, the first connector being connected to an external power supply or driving device, the first connection terminal being electrically connected to the first connector; and a second substrate connected electrically to the first connection terminal and comprising a light emitting device.
摘要翻译： 照明装置包括：第一基板，包括第一连接器和第一连接端子，所述第一连接器连接到外部电源或驱动装置，所述第一连接端子电连接到所述第一连接器; 以及第二基板，电连接到第一连接端子并且包括发光器件。
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公开(公告)号：US08395178B2
公开(公告)日：2013-03-12
申请号：US12788064
申请日：2010-05-26
申请人： Jun Seok Park , Seok Hoon Kang
发明人： Jun Seok Park , Seok Hoon Kang
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , B29C45/14655 , B29C45/34 , H01L24/97 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/12041 , H01L2924/1815 , H01L2924/00014 , H01L2224/85
摘要： A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
摘要翻译： 提供发光器件封装和制造发光器件封装的方法。 首先设置基座，并在基座上形成孔。 在基底上形成发光部之后，在发光部上配置模具，通过该孔注入成形材料。 去除模具以完成包装。
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公开(公告)号：US08178894B2
公开(公告)日：2012-05-15
申请号：US12824824
申请日：2010-06-28
申请人： Jun Seok Park , Seok Hoon Kang
发明人： Jun Seok Park , Seok Hoon Kang
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , B29C45/14655 , B29C45/34 , H01L24/97 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/12041 , H01L2924/1815 , H01L2924/00014 , H01L2224/85
摘要： A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
摘要翻译： 提供发光器件封装和制造发光器件封装的方法。 首先设置基座，并在基座上形成孔。 在基底上形成发光部之后，在发光部上配置模具，通过该孔注入成形材料。 移除模具以完成包装。
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5.发明授权Light emitting device package and manufacture method of light emitting device package 有权发光器件封装及发光器件封装的制造方法公开(公告)号：US07977699B2
公开(公告)日：2011-07-12
申请号：US11720221
申请日：2006-06-07
申请人： Jun Seok Park , Seok Hoon Kang
发明人： Jun Seok Park , Seok Hoon Kang
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , B29C45/14655 , B29C45/34 , H01L24/97 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/12041 , H01L2924/1815 , H01L2924/00014 , H01L2224/85
摘要： A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
摘要翻译： 提供发光器件封装和制造发光器件封装的方法。 首先设置基座，并在基座上形成孔。 在基底上形成发光部之后，在发光部上配置模具，通过该孔注入成形材料。 去除模具以完成包装。
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公开(公告)号：US20100232177A1
公开(公告)日：2010-09-16
申请号：US12788064
申请日：2010-05-26
申请人： Jun Seok Park , Seok Hoon Kang
发明人： Jun Seok Park , Seok Hoon Kang
CPC分类号： H01L33/64 , B29C45/14655 , B29C45/34 , H01L24/97 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/12041 , H01L2924/1815 , H01L2924/00014 , H01L2224/85
摘要： A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
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公开(公告)号：US20100277948A1
公开(公告)日：2010-11-04
申请号：US12824824
申请日：2010-06-28
申请人： Jun Seok Park , Seok Hoon Kang
发明人： Jun Seok Park , Seok Hoon Kang
IPC分类号： F21V7/22
CPC分类号： H01L33/64 , B29C45/14655 , B29C45/34 , H01L24/97 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/12041 , H01L2924/1815 , H01L2924/00014 , H01L2224/85
摘要： A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
摘要翻译： 提供发光器件封装和制造发光器件封装的方法。 首先设置基座，并在基座上形成孔。 在基底上形成发光部之后，在发光部上配置模具，通过该孔注入成形材料。 去除模具以完成包装。
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公开(公告)号：USD575750S1
公开(公告)日：2008-08-26
申请号：US29273699
申请日：2007-03-12
申请人： Seok Hoon Kang
设计人： Seok Hoon Kang
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