公开(公告)号：US20110139858A1

公开(公告)日：2011-06-16

申请号：US12721544

申请日：2010-03-10

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

IPC分类号： B23K31/02 ,  B32B15/01

CPC分类号： H05K3/4644 ,  H05K3/0097 ,  H05K2203/1536 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12986

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

摘要翻译： 这里公开了一种用于制造基板的载体，包括：两个绝缘层，每个绝缘层的一侧上设置有第一金属层，在另一侧上设置有第二金属层; 以及第三金属层，其具有比所述第一金属层低的熔点，并且形成在分别形成在所述两个绝缘层上的所述两个第一金属层之间，使得所述两个第一金属层彼此附接。 载体的优点在于，可以通过加热第三金属层来分离载体，使得在分离载体时基板的尺寸不变，从而保持基板和制造设备之间的相容性。

公开(公告)号：US08156635B2

公开(公告)日：2012-04-17

申请号：US12720567

申请日：2010-03-09

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

IPC分类号： B23P19/00

CPC分类号： H05K3/0097 ,  B32B15/20 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/047 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

摘要翻译： 本文公开了一种用于制造衬底的载体，包括：绝缘层，其包括在其一侧或两侧形成的第一金属层; 形成在所述第一金属层的一侧上的第二金属层; 以及形成在所述第二金属层的一侧上的第三金属层，其中所述第二金属层具有比所述第一金属层或所述第三金属层低的熔点。 载体的优点在于可以通过加热将载置层与载体分离，从而不需要布线过程，结果是当构建层与载体分离时，基底的尺寸不变化 从而重新使用载体并保持基板和制造设备之间的兼容性。