公开(公告)号：US08156635B2

公开(公告)日：2012-04-17

申请号：US12720567

申请日：2010-03-09

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

IPC分类号： B23P19/00

CPC分类号： H05K3/0097 ,  B32B15/20 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/047 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

摘要翻译： 本文公开了一种用于制造衬底的载体，包括：绝缘层，其包括在其一侧或两侧形成的第一金属层; 形成在所述第一金属层的一侧上的第二金属层; 以及形成在所述第二金属层的一侧上的第三金属层，其中所述第二金属层具有比所述第一金属层或所述第三金属层低的熔点。 载体的优点在于可以通过加热将载置层与载体分离，从而不需要布线过程，结果是当构建层与载体分离时，基底的尺寸不变化 从而重新使用载体并保持基板和制造设备之间的兼容性。

公开(公告)号：US20110139858A1

公开(公告)日：2011-06-16

申请号：US12721544

申请日：2010-03-10

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

IPC分类号： B23K31/02 ,  B32B15/01

CPC分类号： H05K3/4644 ,  H05K3/0097 ,  H05K2203/1536 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12986

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

摘要翻译： 这里公开了一种用于制造基板的载体，包括：两个绝缘层，每个绝缘层的一侧上设置有第一金属层，在另一侧上设置有第二金属层; 以及第三金属层，其具有比所述第一金属层低的熔点，并且形成在分别形成在所述两个绝缘层上的所述两个第一金属层之间，使得所述两个第一金属层彼此附接。 载体的优点在于，可以通过加热第三金属层来分离载体，使得在分离载体时基板的尺寸不变，从而保持基板和制造设备之间的相容性。

公开(公告)号：US20130003332A1

公开(公告)日：2013-01-03

申请号：US13532063

申请日：2012-06-25

申请人： Dong Jun Lee ,  Dong Ju Jeon ,  Jung Youn Pang ,  Seong Min Cho ,  Chi Seong Kim

发明人： Dong Jun Lee ,  Dong Ju Jeon ,  Jung Youn Pang ,  Seong Min Cho ,  Chi Seong Kim

IPC分类号： H05K7/00 ,  H05K1/09 ,  B32B15/01 ,  H05K3/00

CPC分类号： H05K1/0242 ,  B32B15/018 ,  C22C19/03 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/54 ,  H01L2224/45144 ,  H01L2224/85444 ,  H05K1/0216 ,  H05K1/09 ,  H05K3/181 ,  H05K3/244 ,  H05K7/00 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2203/072 ,  Y10T428/12889

摘要： Disclosed herein are an electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated layer includes: electroless nickel (Ni) plated coating/palladium (Pd) plated coating/gold (Au) plated coating, wherein each of the electroless nickel, palladium, and gold plated coatings has a thickness of 0.02 to 1 μm, 0.01 to 0.3 μm, and 0.01 to 0.5 μm. In the electroless surface treatment plated layer of the printed circuit board, a thickness of the nickel plated coating is specially minimized to 0.02 to 1 μm, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment plated layer.

摘要翻译： 本文公开了印刷电路板的无电解表面处理电镀层，其制备方法和包括其的印刷电路板。 无电解表面处理镀层包括：镀镍（Ni）镀覆/钯（Pd）镀覆涂层/金（Au）镀层，其中每个无电镍，钯和镀金涂层的厚度为0.02至1 μm，0.01〜0.3μm，0.01〜0.5μm。 在印刷电路板的化学镀处理镀层中，镀镍层的厚度被特别地最小化为0.02〜1μm，从而可以形成优化的无电Ni / Pd / Au表面处理镀层。

公开(公告)号：US09150002B2

公开(公告)日：2015-10-06

申请号：US13532063

申请日：2012-06-25

申请人： Dong Jun Lee ,  Dong Ju Jeon ,  Jung Youn Pang ,  Seong Min Cho ,  Chi Seong Kim

发明人： Dong Jun Lee ,  Dong Ju Jeon ,  Jung Youn Pang ,  Seong Min Cho ,  Chi Seong Kim

IPC分类号： B32B15/10 ,  B32B15/01 ,  H05K7/00 ,  H05K3/24 ,  C22C19/03 ,  C23C18/16 ,  C23C18/32 ,  C23C18/54 ,  H05K1/09 ,  H05K1/02

CPC分类号： H05K1/0242 ,  B32B15/018 ,  C22C19/03 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/54 ,  H01L2224/45144 ,  H01L2224/85444 ,  H05K1/0216 ,  H05K1/09 ,  H05K3/181 ,  H05K3/244 ,  H05K7/00 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2203/072 ,  Y10T428/12889

摘要： An electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated layer includes: electroless nickel (Ni) plated coating/palladium (Pd) plated coating/gold (Au) plated coating, wherein the electroless nickel, palladium, and gold plated coatings have thicknesses of 0.02 to 1 μm, 0.01 to 0.3 μm, and 0.01 to 0.5 μm, respectively. In the electroless surface treatment plated layer of the printed circuit board, a thickness of the nickel plated coating is specially minimized to 0.02 to 1 μm, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment plated layer.

摘要翻译： 印刷电路板的无电解表面处理镀层，其制备方法和包括该印刷电路板的印刷电路板。 无电解表面处理镀层包括：镀镍（Ni）镀层/钯（Pd）镀覆镀层/金（Au）镀层，其中无电镍，钯和镀金涂层的厚度为0.02至1μm，0.01 分别为0.3μm，0.01〜0.5μm。 在印刷电路板的化学镀处理镀层中，镀镍层的厚度被特别地最小化为0.02〜1μm，从而可以形成优化的无电Ni / Pd / Au表面处理镀层。

公开(公告)号：US20130000960A1

公开(公告)日：2013-01-03

申请号：US13472299

申请日：2012-05-15

申请人： Dong Jun LEE ,  Dong Ju Jeon ,  Jung Youn Pang ,  Seong Min Cho ,  Chi Seong Kim

发明人： Dong Jun LEE ,  Dong Ju Jeon ,  Jung Youn Pang ,  Seong Min Cho ,  Chi Seong Kim

IPC分类号： H05K1/09 ,  H05K3/00

CPC分类号： C23C18/1651 ,  C23C18/1806 ,  C23C18/1827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48644 ,  H01L2224/85444 ,  H01L2924/00014 ,  H05K3/244 ,  H05K2203/072 ,  H01L2924/00 ,  H01L2924/207

摘要： Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a copper pad surface roughness-treated to have a surface roughness of 0.1 to 1.0 μm pitch period; and an electroless surface treatment plating layer formed on the copper pad. According to the present invention, when the copper pad has a surface roughness of a predetermined pitch period, the electroless surface treatment plating layer formed on the copper pad also has a surface roughness of the predetermined pitch period, thereby having an effect of widening a surface area and improving workability at the time of a wire bonding process for connection with an external device.

摘要翻译： 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：铜表面粗糙处理以使表面粗糙度为0.1至1.0μm间距周期; 以及形成在铜垫上的化学镀处理镀层。 根据本发明，当铜垫具有预定间距周期的表面粗糙度时，形成在铜焊盘上的化学镀处理镀层也具有预定间距周期的表面粗糙度，从而具有使表面变宽的效果 并且在用于与外部设备连接的引线接合过程时提高可操作性。